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BTB06-600BRG

STMicroelectronics

BTB06-600BRG by STMicroelectronics

BTB06-600BRG by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 6 A and repetitive peak off-state voltage of 600 V. It operates b/w -40 °C to 125 °C with a gate trigger current of 50 mA. Ideal for controlling power in lighting and motor applications.

Median Price

$1.470

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 885 parts In-Stock

1+ parts

$1.470

100+ parts

$0.627

1k+ parts

$0.495

10k+ parts

-

885

$1.470

$0.627

$0.495

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,534 parts In-Stock

1+ parts

$1.644

100+ parts

-

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-

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1,534

$1.644

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Vyrian

USA . 6,338 parts In-Stock

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6,338

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Anansix

USA . 381 parts In-Stock

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381

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Lantek

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.975

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-

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50

-

$0.975

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Microfarads

USA . 48 parts In-Stock

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48

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Distributors (Availability)

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Corphita

USA . 3,691 parts In-Stock

1+ parts

$1.557

100+ parts

-

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3,691

$1.557

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$3.668

100+ parts

-

1k+ parts

$3.301

10k+ parts

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1,065

$3.668

-

$3.301

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MKK Technologies

India . 993 parts In-Stock

1+ parts

$6.898

100+ parts

-

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993

$6.898

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DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$6.898

100+ parts

-

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993

$6.898

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Microchip USA

USA . 8,595 parts In-Stock

1+ parts

$7.410

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8,595

$7.410

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Perfect Parts

USA . 4,467 parts In-Stock

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4,467

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Northwest PG Solutions

USA . 452 parts In-Stock

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452

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Cyclops Electronics Ltd (Excess)

UK . 250 parts In-Stock

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250

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Native Components

USA . 108 parts In-Stock

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108

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Parana Technologies

USA . 63 parts In-Stock

1+ parts

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100+ parts

$4.386

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63

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$4.386

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your projects with the BTB06-600BRG TRIAC from STMicroelectronics, a trusted leader in innovation. Designed for reliability and performance, this versatile component excels in controlling AC loads while ensuring robust operation across diverse applications. Experience peace of mind with its low leakage current and wide operating temperature range. Unleash the potential of your designs and benefit from superior quality and efficiency—choose the BTB06-600BRG for unparalleled value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and protection against environmental factors, making this TRIAC ideal for various applications.

Maximum DC Gate Trigger Current: 50 mA

With a maximum gate trigger current of 50 mA, this TRIAC allows for efficient triggering with lower power consumption, enhancing system performance.

Configuration: SINGLE

The single configuration simplifies circuit design, making it easier to integrate into existing systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, allowing for more compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides excellent mechanical strength and stability, ensuring reliable connections in various environments.

Maximum Leakage Current: 1 mA

A low maximum leakage current of 1 mA indicates high efficiency and reduced power loss during operation.

No. of Terminals: 3

Having 3 terminals facilitates easier connection in control circuits, offering design flexibility.

Package Style (Meter): FLANGE MOUNT

The flange mount provides enhanced mechanical support, making installation simpler and more reliable.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC is suitable for high-temperature environments, increasing its applicability.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant operation allows for greater control and versatility in AC switching applications, making this product suitable for advanced automation.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme low temperatures ensures reliability in outdoor and harsh environmental applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and improves long-term reliability, leading to longer product life.

Terminal Position: SINGLE

A single terminal position simplifies circuit design, providing ease of integration.

Maximum RMS On-state Current: 6 A

Supporting a maximum RMS on-state current of 6 A makes this TRIAC suitable for medium power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage ensures lower control voltage requirements, improving overall system efficiency.

Case Connection: MAIN TERMINAL 2

Main Terminal 2 connection optimizes performance in various circuit configurations, ensuring flexibility.

Repetitive Peak Off-state Voltage: 600 V

A high repetitive peak off-state voltage allows for use in high-voltage applications, enhancing the device's range of use.

Minimum Critical Rate of Rise of Commutation Voltage: 10 V/us

A minimum critical rate of rise of commutation voltage of 10 V/us allows for fast switching applications, improving overall device performance.

Minimum Critical Rate of Rise of Off-state Voltage: 400 V/us

With a very high rate of rise for off-state voltage, this TRIAC provides superior performance in fast switching scenarios, making it suitable for dynamic loads.

Maximum Holding Current: 50 mA

A maximum holding current of 50 mA enables precise control in sensitive applications, providing reliable performance.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB06-600BRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

400 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

1 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

6 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB06-600BRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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