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ACST4-7SFP

STMicroelectronics

ACST4-7SFP by STMicroelectronics

ACST4-7SFP by STMicroelectronics is a single TRIAC designed for high-performance applications. It features a max RMS on-state current of 4A, repetitive peak off-state voltage of 700V, and operates b/w -30 °C to 125 °C. Ideal for controlling AC loads in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,935 parts In-Stock

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3,935

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Digiode

USA . 1,438 parts In-Stock

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1,438

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ComSIT Distribution GmbH

Germany . 1,100 parts In-Stock

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1,100

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Anansix

USA . 388 parts In-Stock

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388

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Velocity Electronics

USA . 50 parts In-Stock

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50

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Corel Iberica Componentes, S.L.

Spain . 20 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 16 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 348 parts In-Stock

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$0.875

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348

$0.875

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Northwest PG Solutions

USA . 1,673 parts In-Stock

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$0.962

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$0.962

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IDEA Electronic Components Group

UK . 69 parts In-Stock

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$4.483

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$4.035

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69

$4.483

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$4.035

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MKK Technologies

India . 1,861 parts In-Stock

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$8.430

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$8.430

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DigiPath Technology Company

USA . 1,861 parts In-Stock

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$8.430

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$8.430

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AZTECH Wire

Italy . 882 parts In-Stock

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$8.720

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

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$17.100

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Perfect Parts

USA . 4,516 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,016 parts In-Stock

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Parana Technologies

USA . 834 parts In-Stock

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$5.360

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834

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$5.360

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Corphita

USA . 324 parts In-Stock

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Assy Fe

Spain . 30 parts In-Stock

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Overview

Elevate your designs with the ACST4-7SFP from STMicroelectronics, a leader in semiconductor innovation. This TRIAC solution ensures exceptional performance across a wide range of applications, from motor control to lighting systems. With its robust reliability and efficient operation, it minimizes energy loss while maximizing safety. Choose ACST4-7SFP for superior quality, reduced maintenance costs, and peace of mind—perfect for engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures good heat resistance and protects the internal components from environmental damage.

Maximum DC Gate Trigger Current: 10 mA

With a maximum DC gate trigger current of just 10 mA, this TRIAC allows for low-power control, making it efficient in various applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for a more compact arrangement, which is beneficial in space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to efficient space utilization on printed circuit boards (PCBs).

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides a secure mechanical and electrical connection, making it robust for various mounting scenarios.

Maximum Leakage Current: 0.5 mA

A maximum leakage current of 0.5 mA ensures minimal power loss and enhances energy efficiency, crucial for energy-sensitive applications.

No. of Terminals: 3

The 3-terminal design is standard for TRIACs, facilitating easy integration into typical control circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy installation and enhances the device's thermal management, critical for reliable operation.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C ensures reliability and performance in high-temperature environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Being a 4 quadrant logic level TRIAC makes this component versatile for both AC loads and non-polarized applications.

Minimum Operating Temperature: -30 °C

The ability to operate down to -30 °C allows this TRIAC to be used in low-temperature environments, enhancing its application range.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and resistance to corrosion, ensuring reliable long-term connections.

Terminal Position: SINGLE

Single terminal position facilitates straightforward circuit integration and minimizes design complexity.

Maximum RMS On-state Current: 4 A

With a maximum RMS on-state current of 4 A, this TRIAC is suitable for medium power applications, making it a robust option.

Maximum DC Gate Trigger Voltage: 1 V

The low maximum DC gate trigger voltage of 1 V allows for excellent compatibility with low-voltage control circuits.

Case Connection: ISOLATED

An isolated case connection minimizes risks of electrical shorts and enhances safety in device operation.

Repetitive Peak Off-state Voltage: 700 V

A high repetitive peak off-state voltage of 700 V ensures this TRIAC can handle significant voltage spikes, increasing reliability.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/µs

The minimum critical rate of rise of off-state voltage at 200 V/µs allows the TRIAC to effectively block high-speed transient voltages.

Maximum Holding Current: 20 mA

A maximum holding current of 20 mA enables the TRIAC to maintain operation while consuming very little current, enhancing efficiency in control applications.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST4-7SFP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

20 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

ACST4-7SFP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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