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74VHC138MTR

STMicroelectronics

74VHC138MTR by STMicroelectronics

74VHC138MTR by STMicroelectronics is a CMOS decoder with a fast propagation delay of 11.5 ns, operating b/w 2-5.5 V. It features a compact SO package and supports military-grade temperatures from -55 °C to 125°C, ideal for reliable applications in harsh environments.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

1k+

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Vyrian

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Bristol Electronics

USA . 4,981 parts In-Stock

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R&J Components

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Anansix

USA . 2,693 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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Atlantic Semiconductor

USA . 2,481 parts In-Stock

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J & M Industries LLC

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Dan-Mar Components

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Digiode

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AZTECH Wire

Italy . 907 parts In-Stock

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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MKK Technologies

India . 1,868 parts In-Stock

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DigiPath Technology Company

USA . 1,868 parts In-Stock

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Microchip USA

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Perfect Parts

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Corphita

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Parana Technologies

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Northwest PG Solutions

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Overview

Elevate your designs with the 74VHC138MTR from STMicroelectronics, a leading name in innovative semiconductor solutions. This high-performance decoder delivers rapid response times and exceptional reliability, making it perfect for applications ranging from consumer electronics to industrial automation. With its compact size and robust features, this versatile device ensures optimal performance while simplifying your circuit design. Trust STMicroelectronics for unmatched quality and cutting-edge technology that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body helps in enhancing durability and ensuring protection against physical damage.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay ensures faster signal integrity and improved overall performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making it suitable for modern applications.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, enhancing flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board layout and facilitates easier placement in densely populated designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operational at 3.3V makes it ideal for low-power applications and compliant with many modern digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures effective operation with minimal interference in high-speed applications.

Power Supplies (V): 2/5.5

The flexible power supply range enhances versatility, allowing it to be used in various system designs.

No. of Terminals: 16

With 16 terminals, this product offers multiple connections for complex circuits while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

Small outline packaging contributes to reduced space requirements on PCB, allowing for efficient circuit design.

Maximum I (ol): 8 Amp

The ability to handle a maximum output current of 8 Amp makes it suitable for demanding applications requiring higher power.

Propagation Delay (tpd): 18 ns

An acceptable propagation delay of 18 ns ensures reliable signal processing in various electronic applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enables this product to be used in demanding environmental conditions.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product is suited for extreme cold environments and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and enhances long-term reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning simplifies routing and enhances flexibility in circuit design layouts.

Maximum Seated Height: 1.75 mm

A low seated height helps in promoting low-profile designs, ideal for space-constrained applications.

Width: 3.9 mm

A narrow width allows for efficient use of board space while still providing robust functionality.

Output Polarity: INVERTED

Inverted output polarity can be beneficial in specific applications, offering versatility in circuit designs.

Minimum Supply Voltage (Vsup): 2 V

This product operates down to 2V, providing flexibility for low-voltage applications and designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds ensures compatibility with standard soldering processes while preserving component integrity.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability allows for compatibility with lead-free soldering processes.

Length: 9.9 mm

Compact length makes it easier to fit into tight PCB layouts without compromising performance.

Temperature Grade: MILITARY

Designed to meet military standards, ensuring reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher integration capabilities essential for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and easy solderability, enhancing component reliability.

Packing Method: TR

Tape and reel packing method allows for automated assembly processes, increasing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A manageable terminal pitch enables easier handling and soldering, ideal for automated assembly lines.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate sensitivity to moisture, ensuring handling and storage practices can be easily managed.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate up to 5.5V allows for compatibility with a wide range of applications and power sources.

Technical Specifications

Decoder & Drivers 74VHC138MTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC138MTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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