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74LCX257TTR

STMicroelectronics

74LCX257TTR by STMicroelectronics

74LCX257TTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 6 ns, operating b/w 2-3.6 V. It features 4 functions and supports dual inputs in a compact SOIC package. Ideal for high-speed data routing in military applications.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 50,000 parts In-Stock

1+ parts

$1.149

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50,000

$1.149

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Chip1Stop

Japan . 50,000 parts In-Stock

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$1.830

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$1.830

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Verical

USA . 50,000 parts In-Stock

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50,000

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Distributors (In-Stock)

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Digiode

USA . 468 parts In-Stock

1+ parts

$1.079

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468

$1.079

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Vyrian

USA . 4,644 parts In-Stock

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4,644

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Anansix

USA . 2,497 parts In-Stock

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2,497

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Lantek

USA . 2,450 parts In-Stock

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2,450

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R&J Components

USA . 2,412 parts In-Stock

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2,412

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Distributors (Availability)

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Native Components

USA . 880 parts In-Stock

1+ parts

$0.090

100+ parts

-

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10k+ parts

$0.086

880

$0.090

-

-

$0.086

Northwest PG Solutions

USA . 1,357 parts In-Stock

1+ parts

$0.099

100+ parts

-

1k+ parts

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$0.087

1,357

$0.099

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$0.087

Corphita

USA . 2,734 parts In-Stock

1+ parts

$1.022

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2,734

$1.022

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Component Stockers USA

USA . 124,765 parts In-Stock

1+ parts

$1.140

100+ parts

$1.140

1k+ parts

$1.140

10k+ parts

$1.140

124,765

$1.140

$1.140

$1.140

$1.140

AZTECH Wire

Italy . 1,172 parts In-Stock

1+ parts

$19.710

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1,172

$19.710

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

1+ parts

$24.222

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$21.800

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2,132

$24.222

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$21.800

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MKK Technologies

India . 1,973 parts In-Stock

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$45.547

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1,973

$45.547

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DigiPath Technology Company

USA . 1,973 parts In-Stock

1+ parts

$45.547

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1,973

$45.547

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Perfect Parts

USA . 11,043 parts In-Stock

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11,043

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A-Z Elektronik GmbH

Germany . 5,148 parts In-Stock

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Microchip USA

USA . 5,067 parts In-Stock

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5,067

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,732 parts In-Stock

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GreenTree Electronics

Israel . 2,450 parts In-Stock

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2,450

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Parana Technologies

USA . 1,186 parts In-Stock

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$28.961

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1,186

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$28.961

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Overview

Unlock superior performance with the 74LCX257TTR from STMicroelectronics—your go-to multiplexer and demultiplexer solution. Renowned for quality, STMicroelectronics ensures reliability in high-speed applications, making it ideal for advanced communication systems, automotive electronics, and industrial automation. With its compact design and low power consumption, this device delivers exceptional value, allowing you to streamline designs while maximizing efficiency and longevity. Enhance your projects with trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

A low propagation delay of 6 ns enables fast switching times, which is crucial for high-speed digital circuits and telecommunications.

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCBs, making it ideal for compact electronic systems.

No. of Functions: 4

Having four functions adds versatility to the product, allowing it to serve multiple roles in data routing and management.

No. of Inputs: 2

The presence of two inputs provides flexibility in configuration and makes it suitable for various applications requiring simple multiplexing.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient layout and integration on PCBs, facilitating easier design and assembly.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7 V enhances compatibility with low-voltage digital circuits, contributing to power efficiency.

Power Supplies (V): 3.3

The compatibility with a 3.3 V power supply ensures usability in modern electronic designs, aligning with typical logic levels.

No. of Terminals: 16

Sixteen terminals provide ample connection options, allowing for versatile integration in various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile minimize space requirements, making it an excellent choice for compact designs.

Maximum I (ol): 24 Amp

A high output current capability of 24 Amps means it can handle robust signals, providing reliability in demanding applications.

Propagation Delay (tpd): 6.5 ns

The propagation delay of 6.5 ns ensures fast operation, making it suitable for time-sensitive applications like data communication and processing.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C allows the product to perform reliably in high-temperature environments, ideal for military and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics enhance the control over data transmission lines, allowing for reduced contention in bus systems.

Minimum Operating Temperature: -55 °C

Rated for a minimum operating temperature of -55 °C, the product is highly suited for extreme environments, such as aerospace and military.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium nickel palladium gold finish ensures excellent corrosion resistance and reliable electrical connections over time.

Terminal Position: DUAL

The dual terminal position enhances versatility in PCB design and layout, offering flexible integration options.

Maximum Seated Height: 1.2 mm

A low maximum seated height of 1.2 mm contributes to the compactness, making it suitable for space-constrained applications.

Width: 4.4 mm

The smaller width allows for greater packing density on PCBs, which is essential for modern electronic devices.

Output Polarity: TRUE

True output polarity ensures that the product functions reliably within standard logic configurations for easy integration.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage of 2 V allows for use in low-power circuits, contributing to energy efficiency.

Length: 5 mm

A compact length of 5 mm is advantageous for miniaturization of electronic designs in portable devices.

Temperature Grade: MILITARY

Being rated for military temperature grade ensures that the product meets stringent performance and reliability standards.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy handling and automated soldering processes, enhancing manufacturing efficiency.

Packing Method: TR

The tape and reel (TR) packing method simplifies automated assembly processes, ensuring efficiency in production.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm provides flexibility in PCB design while maintaining a compact layout.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, providing guidelines for handling during assembly and storage.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V allows for broader compatibility with various electronic circuits while ensuring safety limits.

Technical Specifications

Multiplexer & Demultiplexer 74LCX257TTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LCX257TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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