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74LCX257MTC

Onsemi

74LCX257MTC by Onsemi

74LCX257MTC by Onsemi is a 4-function, 2-input multiplexer with a propagation delay of 6 ns at 2.5V. It operates in industrial temperatures (-40 to 85°C) and has a max supply voltage of 3.6V. Ideal for applications requiring fast switching b/w multiple inputs in compact designs.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Mouser Electronics

USA . 309 parts In-Stock

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$0.570

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$0.379

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$0.321

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$0.245

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$0.245

Arrow

USA . 257 parts In-Stock

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$1.042

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$0.380

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$0.287

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$0.243

257

$1.042

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$0.243

Rochester

USA . 42,300 parts In-Stock

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-

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$0.320

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$0.266

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$0.237

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Verical

USA . 23,500 parts In-Stock

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DigiKey

USA . 4,886 parts In-Stock

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$0.330

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Chip1Stop

Japan . 257 parts In-Stock

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Flip Electronics (Authorized)

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TEDSS.com

USA . 248 parts In-Stock

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$0.210

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

USA . 1,531 parts In-Stock

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Vyrian

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Mil-Aero Solutions, Inc.

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DigiKey Marketplace

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Anansix

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VNN

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Bristol Electronics

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Sea View Technologies

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Electronics Depot

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Prism Electronics

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Atlantic Semiconductor

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Flip Electronics

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LIBRA Elektronik GmbH

Germany . 188 parts In-Stock

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Pegasus Components GmbH

Germany . 48 parts In-Stock

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Speed Components Ltd

Israel . 29 parts In-Stock

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Ampacity Inc.

Singapore . 10,125 parts In-Stock

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$0.178

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Corohmni

South Africa . 374 parts In-Stock

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Corphita

USA . 1,096 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,506 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Kepictronics

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TANS Electronics

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SupplyDigital Components

Austria . 3,367 parts In-Stock

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Supply Digital

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Glotronic Ltd.

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Problanco Electronics

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Assy Fe

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UHIMA Technologies

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Metaverse IC Inc.

Canada . 378 parts In-Stock

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Overview

Unlock the power of efficient data management with the 74LCX257MTC multiplexer by Onsemi. This innovative product offers seamless integration, fast propagation delay, and a compact design, making it ideal for a wide range of applications. Whether you're in the industrial or consumer electronics sector, this multiplexer delivers reliable performance and high-quality results. Trust in Onsemi's reputation for excellence and invest in the 74LCX257MTC for enhanced functionality and value in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring that the product is easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast processing of signals, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

Having 4 functions in one device increases efficiency by reducing the need for multiple components, saving both space and cost.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V ensures compatibility with a wide range of systems, making it versatile for different applications.

Output Characteristics: 3-STATE

The 3-state output allows for a high degree of flexibility in controlling the output signal, providing more control options for the user.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making this multiplexer/demultiplexer efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer 74LCX257MTC attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX257MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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