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74LCX157MTR

STMicroelectronics

74LCX157MTR by STMicroelectronics

74LCX157MTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 6 ns, operating b/w 2-3.6 V. It features 4 functions and supports surface mount applications in compact designs. Ideal for high-speed digital circuits, it ensures reliable performance even at extreme temperatures.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Ashlea Components Ltd

UK . 22,035 parts In-Stock

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Vyrian

USA . 6,864 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 3,513 parts In-Stock

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Semi Source

USA . 2,500 parts In-Stock

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EPE Components Inc.

USA . 2,471 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 2,408 parts In-Stock

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Anansix

USA . 1,605 parts In-Stock

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Digiode

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Microchip USA

USA . 109 parts In-Stock

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$7.429

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IDEA Electronic Components Group

UK . 990 parts In-Stock

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$9.433

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$8.489

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Native Components

USA . 62 parts In-Stock

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$10.935

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Northwest PG Solutions

USA . 337 parts In-Stock

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$12.029

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$10.826

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AZTECH Wire

Italy . 511 parts In-Stock

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MKK Technologies

India . 1,233 parts In-Stock

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DigiPath Technology Company

USA . 1,233 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 6,500 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Parana Technologies

USA . 900 parts In-Stock

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$11.278

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Overview

Unlock unmatched performance with the 74LCX157MTR from STMicroelectronics! This versatile multiplexer/demultiplexer delivers rapid switching speeds and exceptional reliability, making it ideal for advanced applications in telecommunications, automotive, and industrial sectors. Crafted with precision, STMicroelectronics ensures high quality and durability, empowering your designs with efficiency and longevity. Experience superior value and innovation—choose the 74LCX157MTR to elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects the internal components from environmental factors.

Propagation Delay At Nominal Supply: 6 ns

A low propagation delay ensures high-speed data transfer, making the product suitable for applications requiring fast signal processing.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and automated assembly, improving production efficiency.

No. of Functions: 4

Having multiple functions increases flexibility and reduces the need for multiple separate devices, saving space and cost.

No. of Inputs: 2

With two inputs, it allows for versatile multiplexing options, making it suitable for various applications.

Package Shape: RECTANGULAR

A rectangular shape can simplify PCB layout and provide better fitting options in various design scenarios.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal voltage of 2.7V helps optimize power consumption while maintaining performance.

Load Capacitance (CL): 50 pF

A low load capacitance enhances signal integrity and speeds up switching times, making it effective for high-speed applications.

Power Supplies (V): 3.3

Compatible with a standard 3.3V power supply, it integrates easily with most digital systems.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity for various applications while keeping the design compact.

Package Style (Meter): SMALL OUTLINE

The small outline package saves valuable PCB space and is ideally suited for space-constrained applications.

Maximum I (ol): 24 Amp

A high output current capacity allows this device to drive heavy loads, suitable for robust applications.

Propagation Delay (tpd): 6.5 ns

The consistent low propagation delay contributes to the overall speed efficiency of the device.

Maximum Operating Temperature: 125 °C

An extended operating temperature range ensures reliable performance in harsh environments.

Minimum Operating Temperature: -55 °C

This low minimum operating temperature allows for effective use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves solderability and ensures consistent electrical performance.

Terminal Position: DUAL

A dual terminal position enhances flexibility for different PCB layouts and assembly options.

Maximum Seated Height: 1.75 mm

A low seated height allows for minimal profile designs, contributing to compact electronics.

Width: 3.9 mm

The narrow width aids in making designs more compact and versatile.

Output Polarity: TRUE

True output polarity simplifies integration with common digital logic devices.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enables the device to be used in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

A moderate reflow time ensures that components can withstand assembly processes without damage.

Peak Reflow Temperature °C: 260

This high reflow temperature capability makes it compatible with modern soldering techniques.

Length: 9.9 mm

The compact length further aids in space-efficient PCB design.

Temperature Grade: MILITARY

With military-grade specifications, this product is built for reliability and durability in demanding environments.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operations, making it ideal for modern digital applications.

Terminal Form: GULL WING

Gull wing terminals are recognized for their ease of soldering and reliability in connections.

Packing Method: TR

The tape and reel packing method facilitates automated assembly processes and efficient handling.

Terminal Pitch: 1.27 mm

A standard terminal pitch aids in compatibility with most PCB layouts, ensuring ease of design and assembly.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a medium level of moisture sensitivity, guiding appropriate storage and handling practices.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a variety of digital applications while providing design flexibility.

Technical Specifications

Multiplexer & Demultiplexer 74LCX157MTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX157MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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