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74LCX257MX

Onsemi

74LCX257MX by Onsemi

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.780

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 122 parts In-Stock

1+ parts

$1.990

100+ parts

$0.934

1k+ parts

$0.648

10k+ parts

$0.552

122

$1.990

$0.934

$0.648

$0.552

Rochester

USA . 252,210 parts In-Stock

1+ parts

-

100+ parts

$0.683

1k+ parts

$0.567

10k+ parts

$0.506

252,210

-

$0.683

$0.567

$0.506

Verical

USA . 177,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.709

10k+ parts

$0.632

177,500

-

-

$0.709

$0.632

DigiKey

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.850

10k+ parts

-

90,000

-

-

$0.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,178 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$0.531

-

-

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Vyrian

USA . 2,866 parts In-Stock

1+ parts

$0.535

100+ parts

-

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-

10k+ parts

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2,866

$0.535

-

-

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DigiKey Marketplace

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

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60,000

-

-

-

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Freddi Giovanni

Italy . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

2,500

-

-

-

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ComSIT Distribution GmbH

Germany . 1,970 parts In-Stock

1+ parts

-

100+ parts

-

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1,970

-

-

-

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ACDS - Activité Composants Distribution Service

France . 1,853 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,853

-

-

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Dan-Mar Components

USA . 1,853 parts In-Stock

1+ parts

-

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1,853

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Anansix

USA . 397 parts In-Stock

1+ parts

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397

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Semi Source

USA . 160 parts In-Stock

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160

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R&J Components

USA . 99 parts In-Stock

1+ parts

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99

-

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PC Components Company LLC

USA . 47 parts In-Stock

1+ parts

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47

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Bristol Electronics

USA . 47 parts In-Stock

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,393 parts In-Stock

1+ parts

$0.503

100+ parts

-

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-

10k+ parts

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2,393

$0.503

-

-

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Corohmni

South Africa . 437 parts In-Stock

1+ parts

$0.535

100+ parts

-

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-

10k+ parts

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437

$0.535

-

-

-

Component Stockers USA

USA . 58,980 parts In-Stock

1+ parts

$0.580

100+ parts

$0.540

1k+ parts

$0.490

10k+ parts

$0.490

58,980

$0.580

$0.540

$0.490

$0.490

Microchip USA

USA . 2,076 parts In-Stock

1+ parts

$3.770

100+ parts

-

1k+ parts

-

10k+ parts

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2,076

$3.770

-

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Continental Prestige Electronics

USA . 60,000 parts In-Stock

1+ parts

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$0.640

1k+ parts

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60,000

-

$0.640

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Perfect Parts

USA . 8,400 parts In-Stock

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8,400

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TANS Electronics

Latvia . 5,360 parts In-Stock

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5,360

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Kulean Microsystems

USA . 4,010 parts In-Stock

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4,010

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,349 parts In-Stock

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2,349

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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2,000

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Problanco Electronics

Mexico . 1,688 parts In-Stock

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1,688

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Northwest PG Solutions

USA . 1,445 parts In-Stock

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1,445

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Supply Digital

USA . 764 parts In-Stock

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764

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Native Components

USA . 438 parts In-Stock

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438

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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388

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SupplyDigital Components

Austria . 187 parts In-Stock

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187

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Technical Specifications

Multiplexer & Demultiplexer 74LCX257MX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX257MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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