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74LCX157M

Onsemi

74LCX157M by Onsemi

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.808

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 65 parts In-Stock

1+ parts

$0.781

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-

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65

$0.781

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Arrow

USA . 65 parts In-Stock

1+ parts

$0.925

100+ parts

$0.727

1k+ parts

$0.519

10k+ parts

$0.515

65

$0.925

$0.727

$0.519

$0.515

Rochester

USA . 98,840 parts In-Stock

1+ parts

-

100+ parts

$0.779

1k+ parts

$0.646

10k+ parts

$0.576

98,840

-

$0.779

$0.646

$0.576

Flip Electronics (Authorized)

USA . 58,897 parts In-Stock

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58,897

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DigiKey

USA . 31,229 parts In-Stock

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$0.970

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31,229

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$0.970

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Verical

USA . 26,880 parts In-Stock

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$0.808

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$0.721

26,880

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$0.808

$0.721

Distributors (In-Stock)

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Vyrian

USA . 5,771 parts In-Stock

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$0.511

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5,771

$0.511

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Digiode

USA . 6,064 parts In-Stock

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$0.607

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6,064

$0.607

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Component Electronics Inc.

Canada . 13 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

10k+ parts

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13

$1.150

$0.870

$0.750

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Flip Electronics

USA . 58,897 parts In-Stock

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58,897

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DigiKey Marketplace

USA . 31,229 parts In-Stock

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31,229

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ComSIT Distribution GmbH

Germany . 7,676 parts In-Stock

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Connector Distribution Corp

USA . 2,544 parts In-Stock

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2,544

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Right Parts Inc.

USA . 2,544 parts In-Stock

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Anansix

USA . 1,357 parts In-Stock

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1,357

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Ashlea Components Ltd

UK . 853 parts In-Stock

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853

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Zilex Electronics Inc.

Canada . 597 parts In-Stock

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597

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ACDS - Activité Composants Distribution Service

France . 274 parts In-Stock

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Odintec Ltd.

Israel . 144 parts In-Stock

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144

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Sea View Technologies

USA . 140 parts In-Stock

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140

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Bristol Electronics

USA . 140 parts In-Stock

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140

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Prism Electronics

USA . 91 parts In-Stock

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91

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Sogenti Electronics

Canada . 80 parts In-Stock

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80

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Speed Components Ltd

Israel . 40 parts In-Stock

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40

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BCID Electronics Ltd.

Israel . 30 parts In-Stock

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30

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PC Components Company LLC

USA . 7 parts In-Stock

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7

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Resion

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$0.511

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69

$0.511

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Corphita

USA . 7,087 parts In-Stock

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$0.575

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7,087

$0.575

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Microchip USA

USA . 8,834 parts In-Stock

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$9.425

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8,834

$9.425

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IDEA Electronic Components Group

UK . 1,654 parts In-Stock

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$9.516

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$8.565

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1,654

$9.516

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Native Components

USA . 1,187 parts In-Stock

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$10.375

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Northwest PG Solutions

USA . 1,801 parts In-Stock

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$13.152

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$11.837

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$11.837

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MKK Technologies

India . 12 parts In-Stock

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$17.895

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12

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DigiPath Technology Company

USA . 12 parts In-Stock

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$17.895

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12

$17.895

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Continental Prestige Electronics

USA . 98,840 parts In-Stock

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$0.477

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98,840

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$0.477

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RC Electronics

USA . 9,000 parts In-Stock

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$0.720

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$0.680

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$0.670

9,000

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$0.720

$0.680

$0.670

TANS Electronics

Latvia . 6,946 parts In-Stock

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Kulean Microsystems

USA . 6,749 parts In-Stock

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SupplyDigital Components

Austria . 6,425 parts In-Stock

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Perfect Parts

USA . 6,026 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,412 parts In-Stock

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Supply Digital

USA . 1,422 parts In-Stock

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Parana Technologies

USA . 1,180 parts In-Stock

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$11.378

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1,180

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$11.378

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Problanco Electronics

Mexico . 798 parts In-Stock

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798

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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601

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Cyclops Electronics Ltd (Excess)

UK . 274 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer 74LCX157M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LCX157M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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