Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Maximum Standby Current: .0035 Amp; Technology: CMOS;
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$52.492
MRAMs M3008316045NX0ITBR attributes and parameters. Explore more MRAMs devices from Renesas Electronics
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M3008316045NX0ITBR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
1N4148
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
OPA2277UA/2K5
OPA2277UA/2K5 by Texas Instruments is a dual operational amplifier with low offset voltage of 100 uV and micropower consumption of 0.004 uA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1 MHz. With a compact rectangular package style, it is suitable for surface mount designs in various electronic systems.
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
DRV5053VAQLPG
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Sensitron Semiconductor
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T/NOPB
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M3032316035NX0IBCY
Renesas Electronics
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Memory Width: 16;
MR1S08AVYS35
NXP Semiconductors
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Qualification: Not Qualified;
MR0S16ATS35C
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
M3004316045NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; No. of Words Code: 256K; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
MR25H40CDC
Everspin Technologies
Everspin Technologies' MR25H40CDC is a 512Kx8 MRAM with 3.3V supply, operating at -40 to 85°C. It features synchronous operation, small outline package, and industrial temperature grade. Ideal for applications requiring fast non-volatile memory with high endurance and reliability in harsh environments.
MR4A08BYS35
Everspin Technologies' MR4A08BYS35 is a 3.3V MRAM with 2MX8 organization, operating in parallel mode. It offers fast access time of 35ns and low standby current of 0.009Amp. Ideal for applications requiring high-speed non-volatile memory with reliable data retention capabilities.
M3032316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; Minimum Supply Voltage (Vsup): 2.7 V;
M3004316035NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; Minimum Standby Voltage: 2.7 V;
M3016316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Parallel or Serial: PARALLEL; Nominal Supply Voltage / Vsup (V): 3;
MR4S08AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 18.41 mm;
M3004316045NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; No. of Words Code: 256K;
MR25H40CDFR
MR25H40CDFR by Everspin Technologies is a 512Kx8 MRAM with 3.3V supply, operating at -40 to 85°C. It features synchronous mode, small outline package, and industrial temperature grade. Ideal for applications requiring fast and non-volatile memory solutions in compact form factors.
M3004316035NX0PTAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; No. of Functions: 1;
MR25H40MDFR
MR25H40MDFR by Everspin Technologies is a 512Kx8 MRAM with 3.3V supply, operating at -40 to 125 °C. It features synchronous operation, small outline package, and AEC-Q100 screening level. Ideal for automotive applications requiring fast and reliable non-volatile memory solutions.
M3004316045NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Organization: 256KX16; Minimum Data Retention Time: 10;
MR4S16AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MR2S16AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
M3004316045NX0PTAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Peak Reflow Temperature (C): 260;
MR2S16ACYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;
MR25H40MDF
MR25H40MDF by Everspin Technologies is a MRAM with 512KX8 organization, 524288 words, and 4194304 bit memory density. Operating at -40 to 125 °C, it's ideal for automotive applications requiring fast, synchronous data processing with a supply voltage of 3.3V. The compact package style and no lead terminal form make it suitable for space-constrained designs.
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M3004316045NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Words Code: 256K;
M3004316035NX0PTBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Terminal Form: GULL WING;
M3004316035NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; No. of Words Code: 256K;
M3004316045NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 10; Memory Width: 16;
M3004316035NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3004316035NX0PTBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Width: 16; Terminal Position: DUAL;
M3004316045NX0ITAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; JESD-609 Code: e3;
M3004316035NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; Endurance: 100000000000000 Write/Erase Cycles;
M3004316045NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Package Equivalence Code: TSOP54,.46,32;
M3004316035NX0ITAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Density: 4194304 bit;
M3004316035NX0PTAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; Technology: CMOS;
M3004316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Equivalence Code: BGA48,6X8,30;
M3004316035NX0ITAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Moisture Sensitivity Level (MSL): 3;
M3004316035NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 4194304 bit; Maximum Operating Temperature: 105 Cel;
M3004316045NX0ITAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Terminal Finish: TIN;
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