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7130LA100PFI

Renesas Electronics

7130LA100PFI by Renesas Electronics

Renesas Electronics 7130LA100PFI is a 1Kx8 MULTI-PORT SRAM with 1024 words, operating at 5V. It features a max access time of 100ns and operates in industrial temperature range. Suitable for applications requiring fast and reliable data storage in harsh environments.

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Vyrian

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VNN

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AZTECH Wire

Italy . 284 parts In-Stock

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Ampacity Inc.

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Argo Parts USA

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Aranea Global

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Overview

Enhance your electronic devices with the reliable 7130LA100PFI by Renesas Electronics, a top-tier manufacturer in the industry. This SRAM module offers seamless performance and versatility for various applications, ensuring optimal functionality and efficiency. With a focus on quality and innovation, Renesas Electronics delivers cutting-edge technology that exceeds expectations. Elevate your projects with the exceptional value and benefits that the 7130LA100PFI provides, setting you apart from the competition and bringing your creations to the next level.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY:

The use of plastic/epoxy material ensures a lightweight and durable construction, making it suitable for various applications.

Surface Mount YES:

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape SQUARE:

The square package shape provides a compact footprint, maximizing board space utilization and simplifying layout design.

Operating Mode ASYNCHRONOUS:

The asynchronous operation allows for independent and flexible access to data, enabling high-speed performance in various systems.

Input/Output Type COMMON:

The common input/output type simplifies interface connections and enhances compatibility with other components, making integration easier.

Nominal Supply Voltage / Vsup (V) 5:

With a nominal supply voltage of 5V, this SRAM chip is compatible with standard power sources, ensuring reliable operation.

Power Supplies (V) 5:

The 5V power supply ensures stable and consistent power delivery, supporting the overall reliability and performance of the device.

No. of Terminals 64:

The 64 terminals provide ample connectivity options, enabling versatile configurations and ensuring compatibility with various systems.

Package Style (Meter) FLATPACK, LOW PROFILE:

The flatpack, low profile package style offers a slim form factor and efficient heat dissipation, ideal for space-constrained applications.

Maximum Operating Temperature 85 °C:

The high maximum operating temperature of 85°C ensures reliable performance in demanding environments, increasing the versatility of the product.

Organization 1KX8:

The 1KX8 organization offers a balance between memory capacity and data width, suitable for various data storage and processing tasks.

Output Characteristics 3-STATE:

The 3-STATE output characteristics provide flexibility in signal control, allowing for efficient data sharing and manipulation in multi-device setups.

Minimum Standby Voltage 2 V:

The low minimum standby voltage of 2V enhances power efficiency, helping to reduce energy consumption in standby mode.

Minimum Operating Temperature -40 °C:

The low minimum operating temperature of -40°C ensures reliable performance in extreme cold conditions, expanding the product's usability range.

Terminal Finish TIN LEAD:

The tin lead terminal finish offers excellent solderability and conductivity, ensuring secure and stable connections for optimal performance.

Terminal Position QUAD:

The quad terminal position enables easy identification and access to each terminal, facilitating installation and troubleshooting processes.

No. of Ports 2:

With 2 ports available, this SRAM chip supports simultaneous data transfers, enhancing system efficiency and data throughput.

Maximum Seated Height 1.6 mm:

The maximum seated height of 1.6mm allows for a compact design, enabling the integration of the chip in space-restricted applications.

Width 14 mm:

The 14mm width provides a compact footprint, allowing for efficient board layout and maximizing space utilization in electronic devices.

Minimum Supply Voltage (Vsup) 4.5 V:

The minimum supply voltage of 4.5V ensures stable operation even under slight voltage fluctuations, enhancing the reliability of the product.

Maximum Time At Peak Reflow Temperature (s) 30:

With a maximum time of 30 seconds at peak reflow temperature, the chip can withstand soldering processes without compromising its integrity.

Peak Reflow Temperature °C 240:

The peak reflow temperature of 240°C enables reliable soldering operations, ensuring secure attachment to the circuit board.

Length 14 mm:

The 14mm length offers a compact size, making the chip suitable for space-constrained applications without compromising performance.

Temperature Grade INDUSTRIAL:

Designed for industrial applications, this SRAM chip meets rigorous environmental and performance standards, ensuring reliable operation in demanding conditions.

Technology CMOS:

The CMOS technology used in the chip provides low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Parallel or Serial PARALLEL:

The parallel operation mode allows for simultaneous data transfer, enabling fast and efficient communication in parallel processing systems.

Terminal Form GULL WING:

The gull wing terminal form facilitates easy soldering and improves thermal performance, ensuring reliable connections for optimal functionality.

Maximum Supply Current 140 mA:

With a maximum supply current of 140mA, the chip operates efficiently while consuming minimal power, contributing to energy savings.

No. of Words 1024 words:

The 1024-word storage capacity provides ample memory space for data storage and processing, suitable for a wide range of applications.

Memory Width 8:

With an 8-bit memory width, the chip supports efficient data handling and processing, enhancing system performance and responsiveness.

Terminal Pitch 0.8 mm:

The terminal pitch of 0.8mm allows for precise and secure connections, ensuring reliable data transfer and signal integrity.

No. of Words Code 1K:

The 1K word code designation indicates the memory capacity of the chip, enabling easy identification and compatibility with other components.

Moisture Sensitivity Level (MSL) 3:

The MSL 3 rating indicates moderate moisture sensitivity, ensuring proper handling and storage to maintain product reliability.

Maximum Supply Voltage (Vsup) 5.5 V:

With a maximum supply voltage of 5.5V, the chip operates within a safe voltage range, preventing damage due to overvoltage conditions.

Memory Density 8192 bit:

The high memory density of 8192 bits allows for efficient data storage and retrieval, enabling fast access to information for improved system performance.

Memory IC Type MULTI-PORT SRAM:

The multi-port SRAM design supports simultaneous access to multiple memory locations, enhancing data processing speed and system efficiency.

Maximum Standby Current 0.004 Amp:

The low maximum standby current of 0.004A helps conserve power during idle periods, contributing to energy efficiency and prolonged battery life.

Maximum Access Time 100 ns:

With a maximum access time of 100 nanoseconds, the chip delivers fast data retrieval and processing speeds, supporting real-time applications and high-performance computing.

Technical Specifications

SRAM 7130LA100PFI attributes and parameters. Explore more SRAM devices from Renesas Electronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

14 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

64

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

240

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.004 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

140 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

7130LA100PFI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Renesas Electronics

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