Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 70V659S12DRGI is a multi-port SRAM with a memory density of 4718592 bit. It operates at a nominal voltage of 3.3V and has a max access time of 12 ns. This SRAM is commonly used in industrial applications that require high-speed data storage and retrieval.
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The use of plastic/epoxy as the package body material ensures durability and resistance to harsh environments, making this product a reliable choice.
This product is surface mountable, providing easy installation and space-saving benefits, making it suitable for compact designs.
With a single function, this product offers simplicity and ease of use, making it suitable for basic applications.
The square package shape allows for efficient space utilization, making it ideal for applications where board space is limited.
The asynchronous operation mode provides flexibility in accessing the memory, allowing for efficient data transfer, making this product highly efficient.
The common input/output type simplifies integration with other components, resulting in increased compatibility and ease of use.
The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, making it versatile and widely applicable.
This product supports multiple power supply options, providing flexibility in various operating conditions, enhancing reliability and adaptability.
With 208 terminals, this product offers extensive connectivity options, making it suitable for complex systems and high-performance applications.
The flatpack, fine pitch package style allows for a compact footprint and precise PCB integration, making it an ideal choice for space-constrained designs.
With a maximum operating temperature of 85°C, this product can withstand harsh operating conditions, ensuring reliable performance even in challenging environments.
The 128KX36 organization provides a large memory capacity and high data throughput, making it suitable for data-intensive applications and multitasking scenarios.
The 3-STATE output characteristics allow for multiple devices to share the same bus, reducing system complexity and improving overall performance.
The minimum standby voltage of 3.15V ensures low power consumption during idle periods, maximizing energy efficiency and prolonging battery life.
With a minimum operating temperature of -40°C, this product can withstand extreme cold environments, making it suitable for various climate conditions.
The matte tin (Sn) annealed terminal finish provides excellent solderability and corrosion resistance, ensuring reliable and long-lasting connections.
With a quad terminal position, this product offers easy soldering and secure PCB mounting, simplifying the assembly process and ensuring mechanical stability.
With two ports, this product supports simultaneous data access and efficient communication between multiple devices, making it suitable for multi-device systems.
With a maximum seated height of 4.1mm, this product has a low-profile design, allowing for compact system integration and space savings.
The 28mm width of this product ensures compatibility with standard board layouts and facilitates easy integration into existing designs.
With a minimum supply voltage of 3.15V, this product operates efficiently even at low power conditions, making it energy-efficient and suitable for battery-powered applications.
The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow and reliable connections during the manufacturing process, ensuring high-quality and durable assemblies.
With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring robust and durable connections.
The 28mm length of this product enables easy integration into standard board layouts and ensures compatibility with existing system designs.
Designed for industrial-grade applications, this product can withstand extended temperature ranges and harsh operating conditions, making it reliable in demanding environments.
Based on CMOS technology, this product offers low power consumption, high noise immunity, and fast operation, making it suitable for energy-efficient and high-performance applications.
With a parallel data interface, this product allows for fast data transfer and parallel processing, making it suitable for applications requiring high-speed data handling.
The gull-wing terminal form simplifies soldering and PCB assembly processes, ensuring reliable connections and facilitating efficient manufacturing.
With a maximum supply current of 515mA, this product can provide sufficient power for demanding applications, ensuring stable and reliable operation.
With a large number of words supported, this product offers extensive data storage capacity, making it ideal for memory-intensive applications and data processing tasks.
With a memory width of 36 bits, this product can handle larger data sets and provide faster data access, making it suitable for applications requiring high-bandwidth data processing.
The 0.5mm terminal pitch allows for fine-pitched connections, ensuring compatibility with modern PCB designs and facilitating high-density integration.
With a code supporting 128K words, this product offers a large memory capacity, enabling extensive data storage and handling capabilities.
Rated at moisture sensitivity level 3, this product can withstand moderate exposure to moisture during storage and assembly, ensuring reliable performance and reducing the risk of moisture-related failures.
With a maximum supply voltage of 3.45V, this product operates within safe voltage limits, ensuring stable and secure operation without risking excessive voltage stress.
With a high memory density of 4718592 bits, this product offers extensive data storage capabilities, making it suitable for data-intensive applications and large-scale data processing tasks.
This product belongs to the multi-port SRAM (Static Random Access Memory) type, offering fast and simultaneous access to multiple memory locations, enabling efficient data sharing and manipulation.
With a maximum standby current of 0.015 Amp, this product ensures low power consumption during idle periods, maximizing energy efficiency and minimizing power wastage.
With a maximum access time of 12 nanoseconds, this product enables fast data retrieval and efficient processing, making it suitable for time-critical applications and high-performance computing tasks.
SRAM 70V659S12DRGI attributes and parameters. Explore more SRAM devices from Renesas Electronics
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70V659S12DRGI Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
PCN Design/Specification - All Dev Label Chg 1/Dec/2022
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
FDLL4148
Fairchild Semiconductor
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
Semicoa
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
DS1245Y-70
Dallas Semiconductor
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
IDT71V124SA15PHGI8
Renesas Electronics
The Renesas Electronics IDT71V124SA15PHGI8 is a 128Kx8 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features 15ns access time, 1.2mm seated height, and GULL WING terminals. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
71V416L10PHGI8
Renesas Electronics 71V416L10PHGI8 is a 256Kx16 SRAM with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous operation, common I/O type, and 10ns access time. Ideal for applications requiring fast and reliable memory storage in harsh environments.
5962-8685920YA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685920YA is a MILITARY-grade SRAM with 16KX4 organization, operating at 5V. Featuring CERAMIC package, RECTANGULAR shape, and ASYNCHRONOUS mode, it offers 55ns access time for applications requiring high reliability in extreme temperatures.
CY62167DV30LL-55BVXI
Infineon Technologies
Infineon's CY62167DV30LL-55BVXI is a 1MX16 SRAM with 3.3V supply, 55ns access time, and 16-bit memory width. Ideal for industrial applications requiring fast and reliable data storage in a compact GRID ARRAY package with very thin profile and fine pitch design.
71024S25TYGI8
Integrated Device Technology
STANDARD SRAM; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
CY62157EV30LL-45ZXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
5962-8855202XA
Renesas Electronics' 5962-8855202XA is a MIL-STD-883 compliant SRAM with 32KX8 organization, 70ns access time, and 262144-bit memory density. Ideal for military applications requiring a reliable, high-speed memory solution with common I/O type and 3-state output characteristics.
DS1220Y-200
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T24;
IDT70V261L25PFGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
AS7C31024B-12TCN
Alliance Semiconductor
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
70V3589S133BFI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; No. of Functions: 1;
CY14B101LA-SZ45XI
Infineon's CY14B101LA-SZ45XI is a 128Kx8 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 45ns access time, and 1048576-bit memory density. Ideal for applications requiring fast and reliable non-volatile memory storage in compact designs.
M48Z35-70PC1
STMicroelectronics
M48Z35-70PC1 by STMicroelectronics is a 32Kx8 SRAM with 70ns access time and operates at 5V. It features a rectangular package style, asynchronous mode, and 3-STATE output characteristics. Ideal for commercial applications requiring reliable memory storage in devices with parallel data processing needs.
CY14E256LA-SZ45XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
23LC512-I/P
Microchip Technology
23LC512-I/P by Microchip Technology is a 64KX8 SRAM with synchronous operation and separate I/O. It operates at 5V, has a clock frequency of 20 MHz, and industrial temperature grade. Ideal for applications requiring fast, non-volatile memory storage in industrial settings.
IS66WVH8M8DALL-200B1LI
Integrated Silicon Solution
IS66WVH8M8DALL-200B1LI is an 8MX8 SRAM with 200 MHz clock frequency, 1.7-1.95 V supply voltage, and 85°C operating temperature. Ideal for industrial applications requiring high-speed synchronous memory with a thin profile grid array package.
AS6C4008-55ZIN
Alliance Memory
Alliance Memory's AS6C4008-55ZIN is a 512Kx8 SRAM with a max access time of 55ns. It operates asynchronously and has a power supply range of 3V to 5V. This memory IC is commonly used in industrial applications requiring fast and reliable data storage.
CY7C1059DV33-10ZSXI
CY7C1059DV33-10ZSXI by Infineon Technologies is a 1MX8 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features asynchronous mode, 10ns access time, and 3-STATE output characteristics. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
R1RP0416DSB-2PR#D1
Renesas Electronics' R1RP0416DSB-2PR#D1 is a 256Kx16 SRAM with 12ns access time, operating at 5V. It features a small outline package, dual terminal position, and Gull Wing form. Ideal for commercial applications requiring fast and reliable parallel memory operations.
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70V659S12DRGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Memory Density: 4718592 bit;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of Ports: 2;
70V659S12DRGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Terminal Position: QUAD;
70V658S10BF
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA208,17X17,32;
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE; No. of Words Code: 64K;
70V631S10BFG
Renesas Electronics' 70V631S10BFG is a 256Kx18 DUAL-PORT SRAM with 10 ns access time, operating at 3.3V. It features a low profile grid array package and synchronous operation, suitable for high-speed applications in commercial-grade environments. With a memory density of 4718592 bit and common I/O type, it offers fast parallel data processing capabilities.
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA208,17X17,32;
70V631S12PRFGI
DUAL-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
70V631S12PRFI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
70V657S12DRGI8
SRAMs;
SRAMs; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260;
70V631S10BCG8
DUAL-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Memory Density: 4718592 bit;
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Standby Current: .015 Amp;
70V631S10BFG8
DUAL-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B208;
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;
70V657S12DRGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; No. of Words: 32768 words;
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
70V658S12BCI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Operating Mode: ASYNCHRONOUS;
70V659S12DR9
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Terminal Finish: TIN LEAD;
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