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70V631S10BFG

Renesas Electronics

70V631S10BFG by Renesas Electronics

Renesas Electronics' 70V631S10BFG is a 256Kx18 DUAL-PORT SRAM with 10 ns access time, operating at 3.3V. It features a low profile grid array package and synchronous operation, suitable for high-speed applications in commercial-grade environments. With a memory density of 4718592 bit and common I/O type, it offers fast parallel data processing capabilities.

Median Price

$222.519

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 7 parts In-Stock

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$196.700

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Nova Conductors

Japan . 92 parts In-Stock

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$248.337

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$248.337

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VNN

France . 11,176 parts In-Stock

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Vyrian

USA . 200 parts In-Stock

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Dan-Mar Components

USA . 7 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$16.718

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338

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Ampacity Inc.

Singapore . 1,170 parts In-Stock

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$19.000

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Continental Prestige Electronics

USA . 2,723 parts In-Stock

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$248.337

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$243.371

2,723

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$243.371

Component Stockers USA

USA . 5 parts In-Stock

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$270.360

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Microchip USA

USA . 3,994 parts In-Stock

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Argo Parts USA

USA . 2,342 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$243.371

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$235.921

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$230.954

100

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$243.371

$235.921

$230.954

Overview

Experience the unparalleled quality and reliability of Renesas Electronics with the 70V631S10BFG, a cutting-edge SRAM memory device. This product offers customers seamless synchronization, common input/output type, and a wide operating voltage range, making it perfect for a variety of applications. With its compact package design and advanced technology, this dual-port SRAM provides lightning-fast access times and low standby current, ensuring optimal performance in any project. Trust Renesas Electronics to deliver top-notch products that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the SRAM, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it suitable for compact devices.

Package Shape: SQUARE

The square shape of the package provides efficient use of space and easy integration into circuit boards.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and data transfer, making it ideal for applications requiring synchronized data processing.

Input/Output Type: COMMON

The common input/output type simplifies connections and compatibility with other components, making integration seamless.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage offers stable power delivery and efficient performance for the SRAM.

Power Supplies (V): 2.5/3.3,3.3

The dual power supply options allow for flexibility in voltage input, catering to different system requirements.

No. of Terminals: 208

With a large number of terminals, this SRAM can accommodate complex data processing needs and connections.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density and space-saving advantages for high-performance applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliability and performance in demanding environments.

Technical Specifications

SRAM 70V631S10BFG attributes and parameters. Explore more SRAM devices from Renesas Electronics

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

15 mm

Memory Density:

4718592 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

208

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX18

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Standby Current:

.015 Amp

Minimum Standby Voltage:

3.15 V

Sub-Category:

SRAMs

Maximum Supply Current:

500 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

70V631S10BFG Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Renesas Electronics

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