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70V631S10BFG8

Integrated Device Technology

70V631S10BFG8 by Integrated Device Technology

MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$244.505

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$244.505

100+ parts

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1k+ parts

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34

$244.505

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VNN

France . 4,198 parts In-Stock

1+ parts

-

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4,198

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Vyrian

USA . 1,406 parts In-Stock

1+ parts

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1,406

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,459 parts In-Stock

1+ parts

$16.000

100+ parts

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1k+ parts

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1,459

$16.000

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$18.740

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677

$18.740

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$244.505

100+ parts

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1k+ parts

$232.279

10k+ parts

$227.389

2,000

$244.505

-

$232.279

$227.389

Continental Prestige Electronics

USA . 1,247 parts In-Stock

1+ parts

$244.505

100+ parts

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10k+ parts

$239.615

1,247

$244.505

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$239.615

Microchip USA

USA . 3,461 parts In-Stock

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3,461

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Argo Parts USA

USA . 1,638 parts In-Stock

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1,638

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Technical Specifications

SRAM 70V631S10BFG8 attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

15 mm

Memory Density:

4718592 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

208

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX18

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.015 Amp

Minimum Standby Voltage:

3.15 V

Sub-Category:

SRAMs

Maximum Supply Current:

500 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

70V631S10BFG8 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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