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TDA8002CT/C/C1

Philips Semiconductors

TDA8002CT/C/C1 by Philips Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Sternenhof Electronics

Switzerland . 6,460 parts In-Stock

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Digiode

USA . 4,325 parts In-Stock

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Vyrian

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Anansix

USA . 2,330 parts In-Stock

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Sea View Technologies

USA . 171 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 110 parts In-Stock

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One Stop Electronics

USA . 1,505 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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UNI Independent Distributors

Spain . 7,683 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Corphita

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Perfect Parts

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Eliminating Global Boundries, Inc

USA . 27 parts In-Stock

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs TDA8002CT/C/C1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

140 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

TDA8002CT/C/C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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