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Z0109MARLRPG

Onsemi

Z0109MARLRPG by Onsemi

Z0109MARLRPG by Onsemi is a single TRIAC with 1A RMS current, 600V repetitive peak off-state voltage, and 10mA max DC gate trigger current. It operates b/w -40 to 125 °C and is ideal for controlling AC power in various applications like lighting, heating systems, and motor speed control.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,900 parts In-Stock

1+ parts

$1.110

100+ parts

$0.265

1k+ parts

$0.170

10k+ parts

-

1,900

$1.110

$0.265

$0.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,458 parts In-Stock

1+ parts

$1.054

100+ parts

-

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1,458

$1.054

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Vyrian

USA . 8,146 parts In-Stock

1+ parts

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8,146

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Flip Electronics

USA . 2,100 parts In-Stock

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2,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,467 parts In-Stock

1+ parts

$0.940

100+ parts

-

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1,467

$0.940

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Corphita

USA . 754 parts In-Stock

1+ parts

$0.999

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-

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754

$0.999

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Corohmni

South Africa . 301 parts In-Stock

1+ parts

$1.110

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301

$1.110

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$13.160

100+ parts

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252

$13.160

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QUARKTWIN TECHNOLOGY LTD

USA . 20,392 parts In-Stock

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20,392

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Perfect Parts

USA . 12,880 parts In-Stock

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12,880

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TANS Electronics

Latvia . 8,369 parts In-Stock

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8,369

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Kepictronics

USA . 3,995 parts In-Stock

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3,995

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Problanco Electronics

Mexico . 3,413 parts In-Stock

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3,413

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Kulean Microsystems

USA . 3,057 parts In-Stock

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3,057

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SupplyDigital Components

Austria . 2,008 parts In-Stock

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2,008

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GreenTree Electronics

Israel . 1,900 parts In-Stock

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1,900

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Authorized Procurement Solutions

USA . 1,900 parts In-Stock

1+ parts

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1,900

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UHIMA Technologies

Türkiye . 157 parts In-Stock

1+ parts

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157

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Overview

Elevate your electronic designs with the Z0109MARLRPG by Onsemi, a premium quality TRIAC that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this TRIAC is perfect for a wide range of applications. With its high-quality construction and advanced features, customers can expect superior functionality and precision. Experience the value and benefits of using the Z0109MARLRPG in your projects, and take your creations to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use.

Maximum DC Gate Trigger Current: 10 mA

High gate trigger current ensures precise and stable activation of the TRIAC.

Configuration: SINGLE

Single configuration simplifies installation and reduces complexity.

Package Shape: ROUND

Round shape allows for easy integration into various applications.

Terminal Form: WIRE

Wire terminals provide secure connections and easy installation.

Maximum Leakage Current: 0.5 mA

Low leakage current helps in conserving energy and preventing overheating.

No. of Terminals: 3

Three terminals offer flexibility in connections and compatibility with different systems.

Package Style (Meter): CYLINDRICAL

Cylindrical package style enhances heat dissipation and overall performance.

Maximum Operating Temperature: 125 °C

High operating temperature range makes it suitable for a wide range of environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level TRIAC ensures accurate and efficient triggering.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position offers easy connection and space-saving installation.

Maximum RMS On-state Current: 1 A

High on-state current capacity enables handling of heavy loads with ease.

Maximum DC Gate Trigger Voltage: 1.3 V

Low gate trigger voltage ensures efficient and responsive activation.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating provides reliable isolation and protection.

Minimum Critical Rate of Rise of Off-state Voltage: 50 V/us

Fast critical rate of rise enhances safety and prevents voltage spikes.

Maximum Holding Current: 10 mA

High holding current ensures stable operation and prevents unintended turn-off.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for easy and effective soldering during assembly.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0109MARLRPG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

50 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-W3

JESD-609 Code:

e1

Maximum Leakage Current:

.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

1 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0109MARLRPG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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