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STK672-632AN-E

Onsemi

STK672-632AN-E by Onsemi

STK672-632AN-E by Onsemi is a Motion Control IC with 19 terminals, operating at 5V. It features a max output current of 10A and uses HYBRID technology. Ideal for STEPPER MOTOR CONTROL applications due to its FLANGE MOUNT package style and THROUGH-HOLE terminal form.

Median Price

$3.340

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$3.340

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Digiode

USA . 2,016 parts In-Stock

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$3.173

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2,016

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Vyrian

USA . 6,912 parts In-Stock

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Chip Stock

USA . 221 parts In-Stock

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Corphita

USA . 1,713 parts In-Stock

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$3.006

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Corohmni

South Africa . 95 parts In-Stock

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$3.290

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Vigor

Singapore . 140 parts In-Stock

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$7.570

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AZTECH Wire

Italy . 844 parts In-Stock

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$13.020

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Kulean Microsystems

USA . 7,030 parts In-Stock

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Problanco Electronics

Mexico . 6,342 parts In-Stock

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TANS Electronics

Latvia . 6,162 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 1,714 parts In-Stock

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Microchip USA

USA . 222 parts In-Stock

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UHIMA Technologies

Türkiye . 212 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precise motion control with the STK672-632AN-E by Onsemi. As a leader in the industry, Onsemi's Motion Control ICs are known for their superior quality and reliability. Ideal for applications such as stepper motor controllers, this product offers unparalleled value with its high output current of 10 A and hybrid technology. Say goodbye to limitations and hello to seamless motion control with the STK672-632AN-E.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design for easy integration into various applications.

Nominal Supply Voltage (Vsup): 5 V

Stable 5V nominal supply voltage ensures consistent and reliable performance of the motion control IC.

No. of Terminals: 19

With 19 terminals, this motion control IC offers versatile connectivity options for different wiring configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables secure mounting of the IC onto a surface, ensuring stability during operation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides a durable and corrosion-resistant surface for improved longevity of the IC.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller, this IC offers precise and controlled motion for various applications requiring accurate positioning.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage allows for flexibility in power input range while maintaining optimal performance.

Maximum Output Current: 10 A

High maximum output current of 10A enables driving of large loads or multiple motors with ease and efficiency.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies, offering a balance of performance and cost-effectiveness.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides a secure and stable connection, suitable for applications requiring robust connectivity.

Maximum Supply Voltage (Vsup): 5.25 V

With a maximum supply voltage of 5.25V, the IC can handle voltage spikes or variations without compromising its functionality.

Technical Specifications

Motion Control ICs STK672-632AN-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 0V TO 42V SUPPLY

Other IC type:

JESD-30 Code:

R-XZFM-T19

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

19

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

STK672-632AN-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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