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SLSV1T34AMUTAG

Onsemi

SLSV1T34AMUTAG by Onsemi

SLSV1T34AMUTAG by Onsemi is a small outline, very thin profile bus driver with 6 terminals. It operates at -40 to 85 °C and has a load capacitance of 15 pF. With true output polarity, it's ideal for industrial applications requiring unidirectional signal translation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,366 parts In-Stock

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Vyrian

USA . 586 parts In-Stock

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Problanco Electronics

Mexico . 7,709 parts In-Stock

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Kulean Microsystems

USA . 6,657 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,556 parts In-Stock

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Microchip USA

USA . 4,674 parts In-Stock

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SupplyDigital Components

Austria . 1,865 parts In-Stock

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Corphita

USA . 1,196 parts In-Stock

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TANS Electronics

Latvia . 567 parts In-Stock

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Corohmni

South Africa . 429 parts In-Stock

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UHIMA Technologies

Türkiye . 249 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the SLSV1T34AMUTAG by Onsemi, a leading manufacturer in the industry. This innovative bus driver & transceiver offers seamless translation between voltage levels, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this compact and versatile component ensures optimal performance and efficiency. Experience the value and benefits of seamless signal transmission with the SLSV1T34AMUTAG, designed to meet your needs with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Load Capacitance (CL): 15 pF

The low load capacitance ensures fast signal transmission and reliability in high-speed data communication.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product's functionality in cold environments, enhancing its versatility.

Technical Specifications

Bus Driver & Transceivers SLSV1T34AMUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Count Direction:

UNIDIRECTIONAL

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay (tpd):

30.2 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

0.9/4.5V & 0.9/4.5V

Width:

1 mm

Trade Compliance

SLSV1T34AMUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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