Loading...

SLSV4T244MUTAG

Onsemi

SLSV4T244MUTAG by Onsemi

SLSV4T244MUTAG by Onsemi is a 4-bit bus driver with 3-STATE output, operating at a supply voltage range of 0.9V to 4.5V. With a propagation delay of 3.3ns, it is suitable for industrial applications requiring fast signal transmission in compact spaces due to its very thin profile chip carrier package measuring 2mm x 1.7mm and terminal pitch of 0.4mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,660

-

-

-

-

Digiode

USA . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 944 parts In-Stock

1+ parts

$18.740

100+ parts

-

1k+ parts

-

10k+ parts

-

944

$18.740

-

-

-

TANS Electronics

Latvia . 8,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,029

-

-

-

-

Problanco Electronics

Mexico . 3,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

-

-

-

-

Kulean Microsystems

USA . 1,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,899

-

-

-

-

Corphita

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

SupplyDigital Components

Austria . 486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

486

-

-

-

-

Corohmni

South Africa . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

358

-

-

-

-

UHIMA Technologies

Türkiye . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Overview

Experience seamless data transmission with the SLSV4T244MUTAG by Onsemi, a leading manufacturer in the industry. Designed for reliability and efficiency, this bus driver & transceiver boasts a compact rectangular package shape and 3-STATE output characteristics for optimal performance. Ideal for industrial applications, this chip carrier offers a nominal supply voltage of 1.8V and a quick propagation delay of 3.3ns. Trust Onsemi to deliver high-quality solutions that enhance your connectivity needs while maximizing value and functionality.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy installation on a PCB, saving space and reducing assembly time.

No. of Bits: 4

Having 4 bits allows for a good range of data transmission and processing capabilities.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and making the product energy-efficient.

Propagation Delay (tpd): 3.3 ns

Low propagation delay ensures fast signal transmission and response times.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures product functionality in both extreme cold and hot conditions.

Width: 1.7 mm

Compact width makes the product suitable for applications where space is limited.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without any inversion.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures durability during soldering process.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in industrial environments.

Technical Specifications

Bus Driver & Transceivers SLSV4T244MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

ALSO REQIRED 0.9 TO 4.5 V SUPPLY

Family:

SLSV

JESD-30 Code:

R-XQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.3 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.7 mm

Trade Compliance

SLSV4T244MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4