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SLSV1T34AMUTCG

Onsemi

SLSV1T34AMUTCG by Onsemi

SLSV1T34AMUTCG by Onsemi is a small outline, very thin profile bus driver with 6 terminals. It operates at temperatures ranging from -40 to 85 °C and has a load capacitance of 15 pF. With a max supply voltage of 4.5V, it is ideal for industrial applications requiring true output polarity and unidirectional count direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,783 parts In-Stock

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Vyrian

USA . 471 parts In-Stock

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471

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SupplyDigital Components

Austria . 7,926 parts In-Stock

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Problanco Electronics

Mexico . 6,398 parts In-Stock

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Kulean Microsystems

USA . 5,813 parts In-Stock

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TANS Electronics

Latvia . 4,654 parts In-Stock

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Corphita

USA . 1,953 parts In-Stock

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UHIMA Technologies

Türkiye . 625 parts In-Stock

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Corohmni

South Africa . 242 parts In-Stock

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Overview

Discover the exceptional SLSV1T34AMUTCG by Onsemi, a top-tier bus driver & transceiver that delivers unparalleled performance and reliability. Crafted with precision and expertise by Onsemi, this product is designed to exceed expectations in various applications. From its compact package body material to its dual terminal position, this device offers seamless integration and maximum efficiency. Experience the value and benefits of the SLSV1T34AMUTCG, providing true output polarity, low propagation delay, and a wide operating temperature range. Elevate your projects with this industrial-grade solution that guarantees quality and innovation every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material makes the product lightweight and durable, making it ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Load Capacitance (CL): 15 pF

The low load capacitance of 15 pF ensures efficient signal transmission and helps in reducing signal degradation, leading to reliable performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding thermal conditions, making it suitable for industrial applications.

Propagation Delay (tpd): 30.2 ns

The low propagation delay of 30.2 ns ensures fast signal transmission, enabling quick response times in data communication.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage requirement of 0.9 V allows for operation in low-power scenarios, making it energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers SLSV1T34AMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Count Direction:

UNIDIRECTIONAL

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay (tpd):

30.2 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

0.9/4.5V & 0.9/4.5V

Width:

1 mm

Trade Compliance

SLSV1T34AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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