Loading...

SLSV1T34MUTAG

Onsemi

SLSV1T34MUTAG by Onsemi

SLSV1T34MUTAG by Onsemi is a small outline, very thin profile bus driver with 6 terminals. It operates at temperatures ranging from -40 to 85 °C and has a load capacitance of 15 pF. With true output polarity, it is ideal for industrial applications requiring unidirectional count direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,173

-

-

-

-

Vyrian

USA . 1,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 8,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,260

-

-

-

-

Problanco Electronics

Mexico . 7,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,627

-

-

-

-

TANS Electronics

Latvia . 6,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,262

-

-

-

-

Kulean Microsystems

USA . 5,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,768

-

-

-

-

Corphita

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

UHIMA Technologies

Türkiye . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

416

-

-

-

-

Corohmni

South Africa . 188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188

-

-

-

-

Overview

Elevate your electronics with the SLSV1T34MUTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers designed to enhance performance and reliability. This versatile product offers seamless translation capabilities and a wide operating temperature range, making it ideal for a variety of applications. Experience the value of superior technology with the SLSV1T34MUTAG - where precision meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body material is lightweight and durable, making it easy to handle and resistant to damage during operation.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on a PCB, saving time and reducing the overall footprint of the device.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor, making it compatible with a wide range of applications and installation setups.

Load Capacitance (CL): 15 pF

The low load capacitance ensures high signal integrity and reduced signal distortion, leading to reliable data transmission.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and facilitates easy integration with existing circuitry.

Maximum I (ol): 0.5 Amp

The high maximum output current ensures that the device can drive larger loads without overheating or performance degradation.

Propagation Delay (tpd): 30.2 ns

The low propagation delay minimizes signal latency and enables fast data transmission, suitable for real-time applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for use in harsh environments or industrial applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in cold climates or refrigerated environments.

No. of Ports: 2

Having 2 ports allows for simultaneous communication with multiple devices, increasing versatility and flexibility in data transfer.

Technical Specifications

Bus Driver & Transceivers SLSV1T34MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Count Direction:

UNIDIRECTIONAL

JESD-30 Code:

R-PDSO-N6

Length:

1.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.002 mA

Propagation Delay (tpd):

30.2 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Translation:

0.9/4.5V & 0.9/4.5V

Width:

1 mm

Trade Compliance

SLSV1T34MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4