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PCS3I2191AF-16TR

Onsemi

PCS3I2191AF-16TR by Onsemi

PCS3I2191AF-16TR by Onsemi is a Clock Generator with 16 terminals, operating at temperatures from -40 to 85 °C. It has a supply voltage of 3.3V and consumes a max current of 26mA. This CMOS technology device in a small outline package is ideal for industrial applications requiring precise clock generation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,910 parts In-Stock

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Digiode

USA . 1,673 parts In-Stock

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Problanco Electronics

Mexico . 8,106 parts In-Stock

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TANS Electronics

Latvia . 6,351 parts In-Stock

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SupplyDigital Components

Austria . 6,271 parts In-Stock

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Kulean Microsystems

USA . 4,316 parts In-Stock

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Corphita

USA . 901 parts In-Stock

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Corohmni

South Africa . 226 parts In-Stock

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UHIMA Technologies

Türkiye . 187 parts In-Stock

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Overview

Experience seamless performance and precision with the PCS3I2191AF-16TR clock generator by Onsemi. Crafted with top-notch quality and cutting-edge technology, this product guarantees reliability and efficiency in your applications. From industrial automation to telecommunications, this clock generator offers unparalleled value, benefits, and advantages to customers seeking superior performance in their electronic systems. Trust Onsemi for innovative solutions that drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the clock generator, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 3.3

Optimal power supply voltage for stable performance and efficient operation.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with other components in the system.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and streamlined design that enhances the overall efficiency and space utilization in electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments without any performance issues.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for reliability and performance under harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Enables reliable and secure soldering of the clock generator onto the circuit board.

Maximum Supply Current: 26 mA

Efficiently manages power consumption while delivering the required current for operation.

Nominal Supply Voltage: 3.3 V

Stable and consistent supply voltage for reliable performance of the clock generator.

Terminal Pitch: 0.635 mm

Close terminal pitch allows for compact integration and efficient signal routing in the system.

Technical Specifications

Clock Generators PCS3I2191AF-16TR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

26 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

PCS3I2191AF-16TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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