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PCS3E6200AG-06JR

Onsemi

PCS3E6200AG-06JR by Onsemi

PCS3E6200AG-06JR by Onsemi is a clock generator with 2.5/3.3V power supplies, 6 terminals, and max operating temp of 105 °C. Ideal for industrial applications requiring small outline, thin profile packages in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 635 parts In-Stock

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Vyrian

USA . 583 parts In-Stock

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Problanco Electronics

Mexico . 6,191 parts In-Stock

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SupplyDigital Components

Austria . 3,725 parts In-Stock

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Corphita

USA . 2,326 parts In-Stock

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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TANS Electronics

Latvia . 393 parts In-Stock

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Corohmni

South Africa . 223 parts In-Stock

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Kulean Microsystems

USA . 84 parts In-Stock

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Overview

Elevate your electronic designs with the PCS3E6200AG-06JR clock generator by Onsemi. Known for their superior quality and innovative technology, Onsemi delivers precision and reliability in every product. Clock generators are essential components in a variety of applications, providing accurate timing signals for proper functionality. With the PCS3E6200AG-06JR, customers can expect unmatched performance, efficiency, and versatility. Trust Onsemi to power your projects with cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to integrate into different applications.

Surface Mount: YES

The ability for surface mounting enables easy installation on circuit boards, saving space and simplifying the manufacturing process.

Power Supplies (V): 2.5/3.3

With multiple power supply options, the product can be compatible with a variety of systems, providing flexibility in its usage.

No. of Terminals: 6

Having 6 terminals allows for easy connections and integration into circuits, providing a straightforward setup process.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures stability and reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal positions offer versatility in connection options, accommodating various circuit configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand demanding industrial settings with consistent performance.

Maximum Supply Current: 14 mA

The low maximum supply current requirement helps minimize power consumption, making the product energy-efficient.

Terminal Pitch: 0.95 mm

The close terminal pitch allows for compact design and efficient use of space on circuit boards, ideal for applications with limited space.

Technical Specifications

Clock Generators PCS3E6200AG-06JR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G6

No. of Terminals:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

14 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

PCS3E6200AG-06JR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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