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PCS3I2189AG-08TR

Onsemi

PCS3I2189AG-08TR by Onsemi

PCS3I2189AG-08TR by Onsemi is a Clock Generator with 8 terminals, operating at temperatures from -25 to 85 °C. It has a supply voltage of 3.3V and current of 20mA, suitable for CMOS technology applications. This rectangular package in plastic/epoxy material is surface-mountable and features a small outline, thin profile design with 0.635mm terminal pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,228 parts In-Stock

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Vyrian

USA . 796 parts In-Stock

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796

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Kulean Microsystems

USA . 6,109 parts In-Stock

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6,109

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SupplyDigital Components

Austria . 2,278 parts In-Stock

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Corphita

USA . 2,071 parts In-Stock

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Problanco Electronics

Mexico . 605 parts In-Stock

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605

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Corohmni

South Africa . 370 parts In-Stock

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370

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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TANS Electronics

Latvia . 200 parts In-Stock

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Overview

Enhance your electronic devices with the PCS3I2189AG-08TR clock generator by Onsemi. Designed with precision and quality in mind, Onsemi offers a reliable solution for various applications in the tech industry. With its compact design and efficient performance, this clock generator ensures optimal functionality while providing value to customers. Upgrade your devices with Onsemi's innovative technology and experience the benefits of seamless operations and enhanced productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or miniaturized devices.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying manufacturing processes.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, compatible with many electronic systems and devices.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for various components and circuits in the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this clock generator can withstand demanding environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator efficient and reliable.

Maximum Supply Current: 20 mA

Operating with a maximum supply current of 20 mA ensures efficient power usage and prevents overheating.

Technical Specifications

Clock Generators PCS3I2189AG-08TR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

PCS3I2189AG-08TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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