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PCS3I73Z01AWG-08-TT

Onsemi

PCS3I73Z01AWG-08-TT by Onsemi

PCS3I73Z01AWG-08-TT by Onsemi is a Clock Generator with 2.5/3.3V power supplies, 8 terminals, and max operating temp of 85 °C. Ideal for industrial applications requiring precise clock signal generation in compact spaces with surface mount capability and GULL WING terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,750 parts In-Stock

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1,750

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Digiode

USA . 721 parts In-Stock

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721

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 5,245 parts In-Stock

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5,245

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Kulean Microsystems

USA . 4,656 parts In-Stock

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4,656

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TANS Electronics

Latvia . 4,580 parts In-Stock

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4,580

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Problanco Electronics

Mexico . 2,718 parts In-Stock

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2,718

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Corphita

USA . 2,199 parts In-Stock

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2,199

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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667

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Corohmni

South Africa . 117 parts In-Stock

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117

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Overview

Boost your electronic designs with the PCS3I73Z01AWG-08-TT clock generator by Onsemi! Crafted with precision and expertise, this product offers exceptional quality and reliability for a wide range of applications. With its advanced features and innovative technology, this clock generator ensures optimal performance and efficiency in any electronic system. Experience the value and benefits of Onsemi's superior products with the PCS3I73Z01AWG-08-TT, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in the overall design.

Power Supplies (V): 2.5/3.3

The product offers flexibility in power supply options, making it compatible with a variety of systems and voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and functionalities, enabling the clock generator to interface with multiple components efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability in various applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes the clock generator suitable for use in both extreme cold and hot environments without compromising performance.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and ease of soldering, enhancing the product's reliability and manufacturing efficiency.

Maximum Supply Current: 12 mA

The low maximum supply current ensures energy efficiency and minimizes power consumption, making the product cost-effective in the long run.

Technical Specifications

Clock Generators PCS3I73Z01AWG-08-TT attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

12 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

PCS3I73Z01AWG-08-TT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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