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PCS3I2189AG-08TT

Onsemi

PCS3I2189AG-08TT by Onsemi

PCS3I2189AG-08TT clock generator by Onsemi operates at 3.3V with 8 terminals in a small outline package. It features CMOS technology, GULL WING terminals, and a max supply current of 20mA. Ideal for applications requiring precise timing control in temperature range -25 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,445 parts In-Stock

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Vyrian

USA . 817 parts In-Stock

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TANS Electronics

Latvia . 7,991 parts In-Stock

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7,991

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Problanco Electronics

Mexico . 5,224 parts In-Stock

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Kulean Microsystems

USA . 3,377 parts In-Stock

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Corphita

USA . 796 parts In-Stock

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SupplyDigital Components

Austria . 324 parts In-Stock

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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Corohmni

South Africa . 267 parts In-Stock

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Overview

Enhance your electronic designs with the PCS3I2189AG-08TT by Onsemi, a top-quality clock generator that boasts reliability and precision. Manufactured by Onsemi, a trusted name in the industry, this product is ideal for various applications in electronics. With its advanced technology and compact design, this clock generator offers customers unparalleled value and performance. Upgrade your projects with the PCS3I2189AG-08TT and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V ensures compatibility with a wide range of electronic devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the clock generator to other components in a circuit.

Maximum Operating Temperature: 85 °C

The clock generator can perform reliably at high temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature: -25 °C

The clock generator can operate in cold temperatures as well, increasing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient and reliable operation.

Maximum Supply Current: 20 mA

With a maximum supply current of 20mA, the clock generator is energy-efficient and does not draw excessive power.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for compact PCB design and efficient use of space on the circuit board.

Technical Specifications

Clock Generators PCS3I2189AG-08TT attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

PCS3I2189AG-08TT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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