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PCS3I7100AG-06JT

Onsemi

PCS3I7100AG-06JT by Onsemi

PCS3I7100AG-06JT clock generator by Onsemi operates at a max output frequency of 130 MHz. It is designed for industrial applications with a temperature range from -40 to 85 °C. This small outline, very thin profile package has 6 terminals and requires a supply voltage b/w 2.375V to 2.625V for operation.

Median Price

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Lifecycle Status

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< 1k

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Vyrian

USA . 649 parts In-Stock

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649

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Digiode

USA . 145 parts In-Stock

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SupplyDigital Components

Austria . 4,934 parts In-Stock

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TANS Electronics

Latvia . 2,352 parts In-Stock

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Kulean Microsystems

USA . 1,944 parts In-Stock

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Problanco Electronics

Mexico . 1,022 parts In-Stock

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Corphita

USA . 512 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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UHIMA Technologies

Türkiye . 168 parts In-Stock

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Overview

Enhance your electronic devices with the PCS3I7100AG-06JT Clock Generator by Onsemi. Known for their superior quality and innovative technology, Onsemi delivers top-notch solutions for various applications in the electronics industry. This clock generator offers precise timing and synchronization, ensuring optimal performance in your devices. With a compact design and reliable functionality, this product provides exceptional value and benefits to customers seeking high-quality components for their projects. Upgrade your devices with the PCS3I7100AG-06JT and experience the difference Onsemi can make in your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves valuable PCB space, making it more convenient for users.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a range of voltage levels.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into different circuit layouts, enhancing overall design flexibility.

Maximum Output Clock Frequency: 130 MHz

With a maximum clock frequency of 130 MHz, this clock generator can support high-speed operations, making it ideal for demanding applications.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for interfacing with other components, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The compact and slim design of the package style allows for space-efficient PCB layout, ideal for applications with size constraints.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures efficient power consumption, making it suitable for battery-powered devices and reducing overall energy costs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in a variety of environmental conditions, increasing product durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the clock generator to function reliably in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit board layout and connection options, facilitating ease of integration and customization.

Maximum Seated Height: 0.9 mm

The low seated height of 0.9 mm contributes to a compact overall design, enabling the clock generator to be used in space-constrained applications.

Width: 1.6 mm

The narrow width of 1.6 mm allows for a more streamlined and efficient PCB layout, optimizing space usage and enhancing overall design aesthetics.

Length: 2.9 mm

The short length of 2.9 mm helps in minimizing the footprint of the clock generator on the PCB, enabling efficient use of space for other components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation under harsh environmental conditions, making it suitable for a wide range of industrial applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator, along with other peripheral IC types, offers enhanced functionality and compatibility with different system components, expanding application possibilities.

Technology: CMOS

The CMOS technology used in this clock generator provides low power consumption, high noise immunity, and compatibility with various logic levels, enhancing overall performance.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable connections, ensuring secure attachment to the PCB for stable operation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V offers a balanced power input option for optimal performance, catering to a wide range of voltage requirements.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95 mm, the clock generator allows for precise and compact mounting on the PCB, enabling efficient connection with other components.

Nominal Primary Clock/Crystal Frequency: 130 MHz

The nominal primary clock/crystal frequency of 130 MHz ensures stable and accurate clock generation, making it suitable for high-speed applications requiring precise timing.

Technical Specifications

Clock Generators PCS3I7100AG-06JT attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

130 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

130 MHz

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

PCS3I7100AG-06JT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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