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PCFA86210F

Onsemi

PCFA86210F by Onsemi

PCFA86210F by Onsemi is an N-CHANNEL FET with a 150V DS Breakdown Voltage and 0.0063 ohm Drain-Source On Resistance. Ideal for high-power applications, it operates in Enhancement Mode with a max power dissipation of 500W. AEC-Q101 certified, suitable for automotive and industrial sectors.

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 180,122 parts In-Stock

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Flip Electronics

USA . 180,122 parts In-Stock

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Vyrian

USA . 8,453 parts In-Stock

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Digiode

USA . 2,275 parts In-Stock

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AZTECH Wire

Italy . 603 parts In-Stock

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Kulean Microsystems

USA . 8,180 parts In-Stock

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TANS Electronics

Latvia . 8,129 parts In-Stock

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SupplyDigital Components

Austria . 7,645 parts In-Stock

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Problanco Electronics

Mexico . 2,314 parts In-Stock

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Corphita

USA . 1,888 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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Corohmni

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Overview

Unlock the power of innovation with the PCFA86210F by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. The PCFA86210F is a game-changer in the Power Field Effect Transistors category, offering customers a single configuration with a built-in diode for added convenience. Whether you're looking to enhance your device's performance or improve efficiency, this transistor is the perfect solution. Trust Onsemi to provide unmatched value, benefits, and advantages with the PCFA86210F. Elevate your projects with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode helps in protecting the circuit from reverse voltage spikes, improving reliability and reducing the need for external components.

Minimum DS Breakdown Voltage: 150 V

A high breakdown voltage allows for the transistor to handle higher voltages without breakdown, increasing its robustness in various applications.

Maximum Power Dissipation (Abs): 500 W

With a high power dissipation rating, this FET can handle higher power levels without overheating, making it suitable for demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, which offer better control and protection against unintended switching, enhancing the overall performance.

Maximum Drain Current (ID): 169 A

A high drain current rating allows the FET to handle large current loads, making it suitable for high-power applications like motor control and power supplies.

Technical Specifications

Power Field Effect Transistors (FET) PCFA86210F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

502 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

169 A

Maximum Drain-Source On Resistance:

.0063 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

16 pF

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

PCFA86210F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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