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PCFA86361F

Onsemi

PCFA86361F by Onsemi

PCFA86361F by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage, 429W Power Dissipation, and 371A Drain Current. Ideal for high-power applications in automotive electronics due to its AEC-Q101 standard compliance and robust design.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,176 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 740 parts In-Stock

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$14.180

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Problanco Electronics

Mexico . 7,180 parts In-Stock

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Kulean Microsystems

USA . 1,683 parts In-Stock

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TANS Electronics

Latvia . 1,484 parts In-Stock

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SupplyDigital Components

Austria . 1,397 parts In-Stock

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UHIMA Technologies

Türkiye . 746 parts In-Stock

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Corphita

USA . 733 parts In-Stock

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Corohmni

South Africa . 416 parts In-Stock

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Overview

Discover the power of the PCFA86361F by Onsemi, a high-quality N-CHANNEL Power FET with a built-in diode. Designed for enhancement mode operation, this transistor offers exceptional performance in a compact rectangular package. Ideal for a wide range of applications, from automotive to industrial systems, this product provides reliable and efficient power management solutions. With a maximum drain current of 371 A and low on-resistance, customers can trust in the value and benefits that this Onsemi transistor brings to their projects. Elevate your designs with the PCFA86361F and experience the difference in quality and reliability today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their superior performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage, making this product convenient and reliable for use.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltage levels, ensuring stability and protection in power applications.

Maximum Power Dissipation (Abs): 429 W

The high power dissipation rating allows this FET to dissipate heat effectively, reducing the risk of overheating and ensuring long-term reliability.

Maximum Drain Current (ID): 371 A

The high drain current rating indicates the FET's capability to handle high current loads, making it suitable for power applications that require high currents.

Maximum Drain-Source On Resistance: 0.0014 ohm

The low on-resistance results in minimal power loss and efficient operation, making this FET ideal for power conversion and amplification applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) PCFA86361F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

819 mJ

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

371 A

Maximum Drain-Source On Resistance:

.0014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

139 pF

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

PCFA86361F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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