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PCFA86561F

Onsemi

PCFA86561F by Onsemi

PCFA86561F by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 429W Power Dissipation, and 441A Drain Current. Ideal for high-power applications in automotive systems due to its AEC-Q101 standard compliance and robust design.

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5

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1k+

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Bristol Electronics

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AZTECH Wire

Italy . 1,210 parts In-Stock

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Component Stockers USA

USA . 735 parts In-Stock

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Kulean Microsystems

USA . 6,897 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

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Overview

Unlock the power of efficient energy management with the PCFA86561F by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. The N-channel power field-effect transistor with built-in diode offers enhanced performance in a compact package. Perfect for a wide range of applications, this product ensures maximum power dissipation and efficiency. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations. Choose the PCFA86561F for unrivaled value and unparalleled benefits in your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower on-resistance and higher current-carrying capabilities compared to P-CHANNEL FETs, making them ideal for high-power applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage allows this FET to be used in circuits with higher voltage requirements without risk of damage.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and can be used in a wider range of applications compared to depletion mode FETs.

Maximum Power Dissipation (Abs): 429 W

The high power dissipation capability of this FET makes it suitable for high-power applications where heat dissipation is critical.

Maximum Drain Current (ID): 441 A

The high drain current rating allows this FET to handle large current loads without risk of damage.

Maximum Drain-Source On Resistance: 0.0011 ohm

The low on-resistance of this FET results in reduced power loss and improved efficiency in high-power applications.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures that this FET meets automotive-grade requirements for reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) PCFA86561F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1167 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

441 A

Maximum Drain-Source On Resistance:

.0011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

255 pF

JESD-30 Code:

R-XUUC-N2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

PCFA86561F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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