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PCFA86062F

Onsemi

PCFA86062F by Onsemi

The Onsemi PCFA86062F is a N-CHANNEL FET with 100V DS Breakdown Voltage and 0.002 ohm Drain-Source Resistance. Ideal for high-power applications, it operates in Enhancement Mode with 315.7A Drain Current and 429W Power Dissipation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,923 parts In-Stock

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Digiode

USA . 76 parts In-Stock

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Problanco Electronics

Mexico . 4,552 parts In-Stock

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TANS Electronics

Latvia . 3,379 parts In-Stock

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Corphita

USA . 1,051 parts In-Stock

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Kulean Microsystems

USA . 955 parts In-Stock

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SupplyDigital Components

Austria . 760 parts In-Stock

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Corohmni

South Africa . 127 parts In-Stock

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Overview

Unleash the power of innovation with the PCFA86062F by Onsemi. As a leader in Power Field Effect Transistors, Onsemi sets the standard for quality and reliability. This N-CHANNEL FET with built-in diode is perfect for a wide range of applications, offering enhanced performance and efficiency. With a maximum drain current of 315.7A and a low on-resistance of 0.002 ohm, this transistor delivers exceptional power while staying cool under pressure. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the PCFA86062F today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have better performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for high-power applications.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage levels effectively, suitable for applications requiring robustness and reliability.

Avalanche Energy Rating (EAS): 352 mJ

The high avalanche energy rating ensures that the FET can withstand transient voltages and prevent breakdown, making it suitable for demanding environments.

Maximum Power Dissipation (Abs): 429 W

The high power dissipation capability allows this FET to handle high power levels without overheating, making it reliable in high-power applications.

Maximum Drain Current (ID): 315.7 A

With a high maximum drain current rating, this FET can handle heavy loads and deliver high output currents, making it suitable for power-intensive applications.

Technical Specifications

Power Field Effect Transistors (FET) PCFA86062F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

352 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

315.7 A

Maximum Drain-Source On Resistance:

.002 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

29 pF

JESD-30 Code:

R-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Trade Compliance

PCFA86062F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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