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P89C51RC2HBP

Onsemi

P89C51RC2HBP by Onsemi

P89C51RC2HBP by Onsemi is an 8-bit microcontroller with 5V supply, 32 I/O lines, and 32768 ROM words. Widely used in commercial applications due to its FLASH ROM programmability, PWM channels, and operating temperature range of 0-70 °C. Ideal for various projects requiring a reliable and efficient microcontroller solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,924 parts In-Stock

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Digiode

USA . 2,247 parts In-Stock

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Anansix

USA . 1,964 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,597 parts In-Stock

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Problanco Electronics

Mexico . 8,237 parts In-Stock

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UNI Independent Distributors

Spain . 8,003 parts In-Stock

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SupplyDigital Components

Austria . 6,088 parts In-Stock

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Corphita

USA . 3,679 parts In-Stock

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TANS Electronics

Latvia . 3,658 parts In-Stock

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Kulean Microsystems

USA . 1,217 parts In-Stock

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UHIMA Technologies

Türkiye . 745 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Experience the power of innovation with the P89C51RC2HBP microcontroller by Onsemi. As a leader in the industry, Onsemi has crafted a high-quality product that offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features that cater to your specific needs. Unlock endless possibilities with the P89C51RC2HBP and discover the value it brings to your projects. Trust Onsemi to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the package body, making this product suitable for a variety of operating conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this microcontroller can handle a wide range of input voltages, providing flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration and placement onto circuit boards, optimizing space utilization.

Bit Size: 8

An 8-bit architecture allows for efficient data processing and memory utilization, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 5

Operating at a standard 5V power supply, this microcontroller is compatible with many existing systems and power sources.

No. of Terminals: 40

With 40 terminals, this microcontroller offers ample connectivity options for interfacing with external devices and sensors.

Package Style (Meter): IN-LINE

The in-line package style provides easy access to terminals and facilitates efficient PCB layout and assembly.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures reliable operation even in challenging power supply conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller can withstand high temperature environments without compromising performance.

CPU Family: 8051

Part of the popular 8051 CPU family, this microcontroller is well-supported with a wide range of development tools and resources.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and allows for easy connection to external components.

ROM Words: 32768

With a ROM capacity of 32768 words, this microcontroller can store large program code and firmware, enabling complex applications to be implemented.

Width: 15.24 mm

With a compact width of 15.24mm, this microcontroller can easily fit into space-constrained designs.

Length: 52 mm

The length of 52mm provides a balance between compact size and sufficient space for terminal connections and components.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this microcontroller meets the reliability and performance requirements of a wide range of industries.

RAM Bytes: 512

The 512 bytes of RAM provide sufficient memory for data storage and processing, supporting efficient operation of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of this microcontroller.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical strength and ease of soldering, ensuring secure connections in a variety of environments.

Maximum Supply Current: 76 mA

With a maximum supply current of 76mA, this microcontroller can operate reliably without exceeding power limits, enhancing overall system stability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures stable operation within the standard power supply range, reducing the risk of voltage-related issues.

PWM Channels: YES

Support for PWM channels allows for precise control of motor speed, LED brightness, and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and reprogramming, making this microcontroller versatile and future-proof.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides compatibility with standard connectors and facilitates easy PCB design and assembly.

Speed: 33 rpm

With a speed of 33rpm, this microcontroller can process instructions and data quickly, enabling responsive performance in real-time applications.

No. of I/O Lines: 32

32 I/O lines offer ample connectivity options for interfacing with external devices, sensors, and communication interfaces, making this microcontroller versatile and adaptable to various applications.

Technical Specifications

Microcontrollers P89C51RC2HBP attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T40

Length:

52 mm

No. of I/O Lines:

32

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

P89C51RC2HBP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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