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P89C51RC2BN/01,112

NXP Semiconductors

P89C51RC2BN/01,112 by NXP Semiconductors

NXP Semiconductors P89C51RC2BN/01,112 is an 8051 microcontroller with 8-bit architecture, 16-bit address bus, and 33 MHz clock frequency. It features 512 bytes of RAM, 32768 ROM words, and supports PWM channels. Ideal for applications requiring a max supply voltage of 5.5 V in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,912 parts In-Stock

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Anansix

USA . 2,742 parts In-Stock

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Digiode

USA . 888 parts In-Stock

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888

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Nova Conductors

Japan . 100 parts In-Stock

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One Stop Electronics

USA . 856 parts In-Stock

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$14.000

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Microchip USA

USA . 492 parts In-Stock

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AZTECH Wire

Italy . 319 parts In-Stock

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Corohmni

South Africa . 59 parts In-Stock

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Ampacity Inc.

Singapore . 341 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,438 parts In-Stock

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Overview

Experience the exceptional quality and reliability of NXP Semiconductors with the P89C51RC2BN/01,112 microcontroller. Designed to deliver high performance and versatility, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, this product offers unmatched value and benefits to customers. Trust in NXP Semiconductors to provide you with cutting-edge technology that meets your needs. Upgrade your projects with the P89C51RC2BN/01,112 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input options and ensures stable performance.

Address Bus Width: 16

Wider address bus allows for larger memory addressing capabilities, enabling more complex applications to be run smoothly.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to work with in most circuit designs and mounting configurations.

Bit Size: 8

8-bit architecture is suitable for many basic to mid-level computing tasks, providing a balance between performance and cost.

Power Supplies (V): 5

Standard 5V power supply requirement ensures compatibility with a wide range of power sources and simplifies the design process.

No. of Terminals: 40

Having 40 terminals allows for multiple connectivity options and interfaces, making the microcontroller versatile for various projects.

Package Style (Meter): IN-LINE

In-line package style is space-efficient and easy to integrate into circuit layouts, optimizing board space usage.

Minimum Supply Voltage: 4.5 V

Slightly lower minimum supply voltage provides a range of operating conditions while maintaining stable performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows the microcontroller to withstand elevated temperatures in industrial or outdoor environments.

CPU Family: 8051

8051 CPU family is a well-known and established architecture with a wide range of resources and support available for development.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the microcontroller can function even in colder environments without issues.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring secure connections for long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for increased connectivity options and flexibility in circuit design.

ROM Words: 32768

Large ROM capacity of 32768 words allows for storing extensive program data and instructions for complex applications.

Maximum Seated Height: 4.7 mm

Low seated height facilitates compact and slim designs, making the microcontroller suitable for space-constrained applications.

Width: 15.24 mm

Compact width dimension allows for efficient board space utilization and integration into various electronic devices.

External Data Bus Width: 8

8-bit external data bus width offers compatibility with a wide range of peripherals and memory devices, enhancing the product's versatility.

Maximum Clock Frequency: 33 MHz

High maximum clock frequency of 33 MHz provides fast data processing and execution speeds for demanding applications.

Length: 52 mm

Moderate length dimension offers a good balance between board space utilization and accessibility for various mounting options.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard indoor operating conditions, making the microcontroller ideal for commercial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates multiple peripherals on a single chip, reducing external component count and simplifying system design.

RAM Bytes: 512

512 bytes of RAM provide sufficient memory for temporary data storage and processing, supporting multitasking and data manipulation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing overall product efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto PCBs, ensuring reliable connections in various applications.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage simplifies overall power system design and ensures consistent performance under standard operating conditions.

PWM Channels: YES

Built-in PWM channels provide flexible control over analog devices and motors, enhancing the microcontroller's capability for precision control applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick firmware updates without requiring external programming tools, enhancing product accessibility and flexibility.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch simplifies PCB layout and component placement, ensuring compatibility with widely available connectors and sockets.

Speed: 33 rpm

High speed of 33 RPM enables efficient data processing and task execution, making the microcontroller suitable for time-sensitive applications.

No. of I/O Lines: 32

Having 32 I/O lines provides ample interfacing options for connecting to external devices and sensors, enhancing the product's versatility in control applications.

Technical Specifications

Microcontrollers P89C51RC2BN/01,112 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T40

JESD-609 Code:

e3

Length:

52 mm

No. of I/O Lines:

32

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

4.7 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

P89C51RC2BN/01,112 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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