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P89C51RC2HBA

Onsemi

P89C51RC2HBA by Onsemi

P89C51RC2HBA by Onsemi is an 8-bit microcontroller with 32 I/O lines, 512 bytes of RAM, and 32768 ROM words. It operates at a speed of 33 rpm and has PWM channels for various applications. The chip carrier package style makes it suitable for commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Digiode

USA . 4,925 parts In-Stock

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Vyrian

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Anansix

USA . 1,580 parts In-Stock

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Q Components

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Lantek

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J & M Industries LLC

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

India . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Prism Electronics

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One Stop Electronics

USA . 926 parts In-Stock

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$34.000

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TANS Electronics

Latvia . 7,277 parts In-Stock

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Kulean Microsystems

USA . 6,778 parts In-Stock

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UNI Independent Distributors

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Problanco Electronics

Mexico . 3,391 parts In-Stock

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SupplyDigital Components

Austria . 1,296 parts In-Stock

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UHIMA Technologies

Türkiye . 853 parts In-Stock

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Corphita

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Corohmni

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Perfect Parts

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GreenTree Electronics

Israel . 25 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of innovation with the P89C51RC2HBA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality microcontrollers that are ideal for a wide range of applications. With advanced features and reliable performance, this product offers unmatched value to customers seeking cutting-edge solutions. Upgrade your projects with the P89C51RC2HBA and experience the benefits of superior technology and seamless functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for package, ensuring longevity and affordability of the product.

Surface Mount: YES

Allows for easy and efficient mounting on the circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Wide voltage range allows for flexibility in power supply options and compatibility with different systems.

Package Shape: SQUARE

Compact square shape saves space on the PCB and provides a neat and organized layout of components.

Bit Size: 8

8-bit architecture offers sufficient processing power for basic to moderate level applications, suitable for various projects.

Power Supplies (V): 5

Standard power supply voltage ensures compatibility with common power sources and ease of integration.

No. of Terminals: 44

Sufficient terminals for interfacing with external components and peripherals, allowing for versatile connectivity options.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a secure and reliable housing for the microcontroller, protecting it from environmental factors and mechanical damage.

Minimum Supply Voltage: 4.5 V

Relatively low minimum supply voltage ensures efficient operation even under lower power conditions, enhancing energy efficiency.

Maximum Operating Temperature: 70 °C

High operating temperature range enables reliable performance in diverse environmental conditions, ensuring product durability.

CPU Family: 8051

Part of a well-established and widely used CPU family, ensuring compatibility with existing software and support resources.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in colder environments, suitable for various applications.

Terminal Position: QUAD

Quad terminal position offers organized and space-efficient layout for connecting external devices, enhancing PCB design flexibility.

ROM Words: 32768

Abundant ROM capacity allows for storing a large amount of program data, accommodating complex application requirements.

Width: 16.585 mm

Compact width dimensions facilitate space-efficient PCB layout and integration into compact electronic devices.

Length: 16.585 mm

Compact length dimensions facilitate space-efficient PCB layout and integration into compact electronic devices.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating ensures stable performance in standard operating environments, suitable for most commercial applications.

RAM Bytes: 512

Adequate RAM capacity for efficient data storage and processing, enabling smooth and responsive operation of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: J BEND

J bend terminal form facilitates easy and secure soldering onto the PCB, ensuring reliable electrical connections.

Maximum Supply Current: 76 mA

Moderate supply current requirement for efficient power usage, reducing operational costs and heat generation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, allowing for applications such as motor speed control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility to update firmware and program code, facilitating future upgrades and customization.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into standard PCB layouts, ensuring compatibility with widely available components and connectors.

Speed: 33 rpm

Moderate processing speed suitable for a wide range of applications, balancing performance and power efficiency.

No. of I/O Lines: 32

Sufficient number of I/O lines for connecting external devices and sensors, enabling versatile input and output options for various projects.

Technical Specifications

Microcontrollers P89C51RC2HBA attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.585 mm

Trade Compliance

P89C51RC2HBA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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