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P89C51RC2HBB

Onsemi

P89C51RC2HBB by Onsemi

P89C51RC2HBB by Onsemi is an 8-bit microcontroller with 32768 ROM words and 512 RAM bytes. Operating at a speed of 33 rpm, it has a supply voltage of 5V and max current of 76 mA. Ideal for commercial applications requiring a reliable CPU like industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,680 parts In-Stock

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5,680

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Digiode

USA . 5,478 parts In-Stock

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5,478

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Anansix

USA . 1,237 parts In-Stock

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1,237

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One Stop Electronics

USA . 1,482 parts In-Stock

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$2.000

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1,482

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Kulean Microsystems

USA . 5,801 parts In-Stock

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5,801

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UNI Independent Distributors

Spain . 5,496 parts In-Stock

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Problanco Electronics

Mexico . 4,823 parts In-Stock

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4,823

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SupplyDigital Components

Austria . 3,019 parts In-Stock

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3,019

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TANS Electronics

Latvia . 2,511 parts In-Stock

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Corphita

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 602 parts In-Stock

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602

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Corohmni

South Africa . 444 parts In-Stock

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Overview

Elevate your projects with the P89C51RC2HBB microcontroller by Onsemi, a trusted manufacturer known for delivering top-quality products. Perfect for a wide range of applications, this 8-bit microcontroller offers unparalleled value and benefits to customers. Power up your designs with its impressive features, including 32768 ROM words, 512 RAM bytes, and flash ROM programmability. Whether you're a hobbyist or a seasoned professional, this versatile device will take your creations to the next level. Experience innovation at its finest with the P89C51RC2HBB - unleash your creativity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly and saves space, making the product ideal for compact designs.

Bit Size: 8

The 8-bit architecture enables efficient processing of data and instructions, making the microcontroller suitable for applications that do not require high computational power.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources and simplifies the power management for the overall system.

No. of Terminals: 44

Having 44 terminals allows for a wide range of input/output connections, enabling the microcontroller to interface with various external devices.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile and efficient thermal dissipation, making it suitable for space-constrained applications with heat dissipation requirements.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the microcontroller can reliably function in a wide range of environments without overheating.

CPU Family: 8051

The 8051 CPU family is well-established and widely used, offering a proven and reliable architecture for a variety of applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the microcontroller can operate in both cold and moderate temperature environments without performance issues.

ROM Words: 32768

Having 32K ROM words provides ample storage for program instructions, allowing for complex algorithms and functionality to be implemented on the microcontroller.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures reliable operation in typical indoor environments, making it suitable for a wide range of commercial applications.

RAM Bytes: 512

512 bytes of RAM provide temporary storage for data and variables during program execution, allowing for efficient data processing and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide mechanical strength, ensuring secure connections for reliable operation.

Maximum Supply Current: 76 mA

Having a maximum supply current of 76mA ensures efficient power usage and prevents overloading of the power source.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the power management for the overall system.

ROM Programmability: FLASH

ROM programmability using flash technology allows for easy reprogramming of the microcontroller, enabling flexibility in firmware updates and modifications.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8mm enables high-density PCB layouts, allowing for compact designs and efficient use of space.

Speed: 33 rpm

Operating at a speed of 33rpm ensures fast and responsive performance, making the microcontroller suitable for real-time applications that require quick data processing.

Technical Specifications

Microcontrollers P89C51RC2HBB attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQFP-G44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

P89C51RC2HBB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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