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P89C51RD2HBA

Onsemi

P89C51RD2HBA by Onsemi

P89C51RD2HBA by Onsemi is an 8-bit microcontroller with 65536 ROM words and 1024 RAM bytes. Operating at a speed of 33 rpm, it has a supply voltage of 5V and max current of 76mA. Ideal for commercial applications requiring a reliable CPU like industrial automation systems.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Vyrian

USA . 2,343 parts In-Stock

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Digiode

USA . 2,218 parts In-Stock

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Anansix

USA . 242 parts In-Stock

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Chip Stock

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Executive Electronics, Inc.

USA . 100 parts In-Stock

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LWI Electronics Inc

India . 55 parts In-Stock

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Speed Components Ltd

Israel . 25 parts In-Stock

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Huijzer Components

Netherlands . 22 parts In-Stock

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Q Components

USA . 21 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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ECAB

Sweden . 9 parts In-Stock

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Sunrise Surplus Inc.

USA . 5 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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Component Stockers USA

USA . 2,924 parts In-Stock

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$2.220

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$2.110

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One Stop Electronics

USA . 405 parts In-Stock

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Corphita

USA . 6,332 parts In-Stock

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TANS Electronics

Latvia . 6,242 parts In-Stock

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Kulean Microsystems

USA . 5,425 parts In-Stock

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UNI Independent Distributors

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Problanco Electronics

Mexico . 3,893 parts In-Stock

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SupplyDigital Components

Austria . 2,522 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 718 parts In-Stock

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Corohmni

South Africa . 252 parts In-Stock

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Assy Fe

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Overview

Experience unmatched quality and reliability with the P89C51RD2HBA microcontroller by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and durability. With applications ranging from automotive to consumer electronics, this product offers exceptional value and benefits to customers. Stay ahead of the competition with the advantages that the P89C51RD2HBA brings to your projects, delivering innovative solutions and ease of use for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection, making the microcontroller suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Bit Size: 8

An 8-bit microcontroller is cost-effective and suitable for simpler applications where 16 or 32 bits are not necessary.

Power Supplies (V): 5

Operating at 5V makes the microcontroller compatible with many standard power sources and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient heat dissipation, suitable for applications where space is limited.

CPU Family: 8051

The 8051 CPU family is well-established and widely used, ensuring good support, resources, and compatibility for development.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store more program code, allowing for complex functionalities and applications.

RAM Bytes: 1024

Having sufficient RAM allows for efficient data processing and multitasking, making the microcontroller suitable for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Maximum Supply Current: 76 mA

The low maximum supply current ensures efficient power usage and reduces the need for a high-capacity power source.

Technical Specifications

Microcontrollers P89C51RD2HBA attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

P89C51RD2HBA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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