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P89C668HFA/00,512

NXP Semiconductors

P89C668HFA/00,512 by NXP Semiconductors

NXP Semiconductors P89C668HFA/00,512 is an 8051 microcontroller with 8-bit CPU, 16-bit address bus, and 8-bit external data bus. It operates at a max clock frequency of 33 MHz and has flash ROM programmability. This chip carrier package is suitable for industrial applications requiring a microcontroller with PWM channels and 32 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,212 parts In-Stock

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Digiode

USA . 3,921 parts In-Stock

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Anansix

USA . 2,562 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 816 parts In-Stock

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$9.739

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Ampacity Inc.

Singapore . 1,035 parts In-Stock

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$11.000

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One Stop Electronics

USA . 972 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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$21.090

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Microchip USA

USA . 437 parts In-Stock

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Continental Prestige Electronics

USA . 2,682 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

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UNI Independent Distributors

Spain . 1,409 parts In-Stock

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Overview

Experience the next level of performance with the P89C668HFA/00,512 microcontroller by NXP Semiconductors. This versatile chip offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With its advanced features and cutting-edge technology, this microcontroller provides customers with enhanced functionality and efficiency. Upgrade your projects today with the P89C668HFA/00,512 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and making assembly easier.

Maximum Supply Voltage: 5.25 V

Support for a maximum supply voltage of 5.25V provides flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 16

A wide address bus width of 16 bits allows for larger memory addressing capabilities, suitable for applications requiring extensive memory access.

Bit Size: 8

8-bit processing capability is ideal for many embedded control applications and offers a good balance between performance and cost.

Power Supplies (V): 5

Standard power supply voltage of 5V ensures compatibility with common power sources and simplifies system design.

No. of Terminals: 44

A higher number of terminals provide more connectivity options and flexibility in interfacing with external components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact form factor, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in demanding industrial environments.

CPU Family: 8051

The 8051 CPU family has a proven track record in embedded systems design and offers a wide range of development tools and resources.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features on a single chip, simplifying system design and reducing component count.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing program code and data, suitable for complex applications.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes provides temporary storage for data and variables, enabling efficient program execution.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Speed: 33 rpm

High clock frequency of 33 MHz enables fast processing speeds, suitable for real-time control and computation.

Technical Specifications

Microcontrollers P89C668HFA/00,512 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

4.57 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

64 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

P89C668HFA/00,512 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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