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P89C51RC2HFA

Onsemi

P89C51RC2HFA by Onsemi

P89C51RC2HFA by Onsemi is an 8-bit microcontroller with 32768 ROM words and 512 RAM bytes. Operating at a speed of 33 rpm, it has a supply voltage of 5V and max current of 76mA. Ideal for industrial applications requiring high-speed processing in a compact square chip carrier package.

Median Price

$7.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 254 parts In-Stock

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$7.000

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Digiode

USA . 2,835 parts In-Stock

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Anansix

USA . 872 parts In-Stock

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Sunrise Surplus Inc.

USA . 146 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,472 parts In-Stock

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$17.000

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UNI Independent Distributors

Spain . 7,595 parts In-Stock

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Corphita

USA . 5,466 parts In-Stock

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Kulean Microsystems

USA . 4,958 parts In-Stock

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SupplyDigital Components

Austria . 3,571 parts In-Stock

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TANS Electronics

Latvia . 2,742 parts In-Stock

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Problanco Electronics

Mexico . 714 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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ChipstoGo Electronic ltd

UK . 80 parts In-Stock

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Unleash the power of innovation with the P89C51RC2HFA microcontroller by Onsemi. This cutting-edge device offers unparalleled quality and reliability, backed by a trusted manufacturer known for delivering top-notch products. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, benefits, and advantages. Say goodbye to limitations and hello to endless possibilities with the P89C51RC2HFA - the ultimate solution for all your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and improving overall device reliability.

Package Shape: SQUARE

The square package shape makes the microcontroller easy to handle and integrate into different electronic designs.

Bit Size: 8

The 8-bit architecture is suitable for handling basic computing tasks efficiently and cost-effectively.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources and simplifies the design of power supply circuits.

No. of Terminals: 44

Having a sufficient number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and compact form factor for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

CPU Family: 8051

The 8051 CPU family is well-established and widely used, ensuring support for a variety of software development tools and resources.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the microcontroller suitable for use in cold environments without sacrificing performance.

Terminal Position: QUAD

Quad terminal position provides mechanical stability and efficient soldering during PCB assembly.

ROM Words: 32768

Having a large ROM capacity allows for storing complex programs and data, enabling versatile functionality in embedded systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature ranges, ensuring reliable operation in demanding applications.

RAM Bytes: 512

Ample RAM capacity enables efficient data processing and multitasking capabilities in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: J BEND

J bend terminal form provides mechanical strength and ease of soldering, enhancing the durability and reliability of the connections.

Maximum Supply Current: 76 mA

The low maximum supply current ensures efficient power usage and minimizes heat dissipation in the microcontroller.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies power management and compatibility with other electronic components.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of the microcontroller's functionality.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, the microcontroller can be easily integrated into various PCB layouts and designs.

Speed: 33 rpm

Operating at 33 RPM ensures high processing speed and responsiveness in executing instructions, making the microcontroller suitable for real-time applications.

Technical Specifications

Microcontrollers P89C51RC2HFA attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

CPU Family:

8051

JESD-30 Code:

S-PQCC-J44

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

P89C51RC2HFA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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