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P2781AG-08ST

Onsemi

P2781AG-08ST by Onsemi

P2781AG-08ST by Onsemi is a Clock Generator with 78 MHz output frequency, suitable for commercial applications. It operates b/w 0 to 70 °C and requires a supply voltage of 3V to 3.6V. The small outline package has 8 terminals and is surface mountable, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,484 parts In-Stock

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Vyrian

USA . 492 parts In-Stock

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492

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Problanco Electronics

Mexico . 5,160 parts In-Stock

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Kulean Microsystems

USA . 3,362 parts In-Stock

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TANS Electronics

Latvia . 2,795 parts In-Stock

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Corphita

USA . 2,311 parts In-Stock

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SupplyDigital Components

Austria . 1,824 parts In-Stock

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Enhance your electronic designs with the P2781AG-08ST by Onsemi, a top-quality clock generator that offers precision and reliability. Onsemi's reputation for excellence in manufacturing ensures that this product meets the highest standards of performance. Ideal for a wide range of applications, this clock generator provides customers with unparalleled value and benefits, making it the perfect choice for your next project. Experience the advantages of Onsemi's expertise with the P2781AG-08ST today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the clock generator suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The higher supply voltage ensures stable and reliable performance under different operating conditions.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the clock generator into the overall design of the circuit board.

Maximum Output Clock Frequency: 78 MHz

A high output clock frequency of 78 MHz enables the clock generator to drive high-speed digital circuits effectively.

No. of Terminals: 8

Having 8 terminals allows for efficient connectivity with other components in the system, ensuring proper signal transmission.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it an ideal choice for compact electronic devices.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources, enhancing versatility.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the clock generator is suitable for applications that require reliable operation in harsh environments.

Minimum Operating Temperature: 0 °C

The clock generator can operate effectively even at low temperatures, making it suitable for a variety of operating environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and ensure proper signal routing for efficient performance.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact design, making the clock generator suitable for slim and space-constrained applications.

Width: 3.91 mm

The narrow width of the clock generator enables easy integration into densely populated PCBs, enhancing overall design flexibility.

Length: 4.9 mm

The compact length of the clock generator contributes to a space-efficient design, making it suitable for small electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator belongs to the category of peripheral ICs, offering additional features and functionalities beyond just generating clock signals.

Technology: CMOS

The CMOS technology used in the clock generator ensures low power consumption and compatibility with a wide range of digital circuits.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering on the PCB, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in electronic systems, ensuring compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for efficient placement of the clock generator on the PCB, reducing signal interference and improving overall signal integrity.

Nominal Primary Clock/Crystal Frequency: 78 MHz

The nominal primary clock/crystal frequency of 78 MHz ensures accurate timing for digital circuits and communication systems, making the clock generator a reliable choice.

Technical Specifications

Clock Generators P2781AG-08ST attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

78 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.91 mm

Peripheral IC Type:

Trade Compliance

P2781AG-08ST Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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