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P2781A-08SR

Onsemi

P2781A-08SR by Onsemi

P2781A-08SR by Onsemi is a Clock Generator with 78 MHz output frequency, suitable for commercial applications. It operates b/w 0 to 70 °C and requires a supply voltage of 3V to 3.6V. The package style is small outline with surface mount feature, making it ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 3,625 parts In-Stock

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Vyrian

USA . 2,133 parts In-Stock

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Digiode

USA . 877 parts In-Stock

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Cyclops Electronics Ltd

UK . 798 parts In-Stock

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Perfect Parts

USA . 8,120 parts In-Stock

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Problanco Electronics

Mexico . 6,444 parts In-Stock

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Kulean Microsystems

USA . 5,480 parts In-Stock

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SupplyDigital Components

Austria . 4,564 parts In-Stock

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Metaverse IC Inc.

Canada . 3,851 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,625 parts In-Stock

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TANS Electronics

Latvia . 2,372 parts In-Stock

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Kepictronics

USA . 2,206 parts In-Stock

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Assy Fe

Spain . 2,206 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 262 parts In-Stock

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Corohmni

South Africa . 214 parts In-Stock

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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Overview

Discover the innovative P2781A-08SR clock generator by Onsemi, known for its superior quality and reliability in the industry. This versatile product is designed to meet a wide range of applications, offering customers unparalleled value and performance. With a maximum output clock frequency of 78 MHz and small outline package style, this clock generator is perfect for various electronic devices. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and enhances your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power input options for various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, optimizing layout and design.

Maximum Output Clock Frequency: 78 MHz

High maximum output clock frequency enables the product to support fast and precise timing requirements.

No. of Terminals: 8

Having 8 terminals allows for connections to multiple components, enhancing versatility and compatibility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and makes the product suitable for compact electronic devices.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing usability.

Maximum Operating Temperature: 70 °C

Wide maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the product to function effectively even in colder environments.

Terminal Finish: TIN LEAD

TIN LEAD terminal finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexible placement on the circuit board, accommodating different design layouts.

Maximum Seated Height: 1.75 mm

Low maximum seated height minimizes the space occupied by the product on the circuit board.

Width: 3.91 mm

Narrow width makes the product suitable for compact electronic devices with limited space available.

Length: 4.9 mm

Short length further contributes to space-saving design, fitting well in tight layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions found in commercial products.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Clock generator with additional peripheral functionality provides more value and flexibility for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy installation and rework on the circuit board, saving time and effort.

Nominal Supply Voltage: 3.3 V

Close to 3.3 V nominal supply voltage is commonly used in electronic devices, ensuring compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm allows for easy connections and compatibility with common electronic components.

Nominal Primary Clock/Crystal Frequency: 78 MHz

High nominal primary clock/crystal frequency of 78 MHz supports fast and accurate timekeeping in various applications.

Technical Specifications

Clock Generators P2781A-08SR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

78 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.91 mm

Peripheral IC Type:

Trade Compliance

P2781A-08SR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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