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P2781AF-08TT

Onsemi

P2781AF-08TT by Onsemi

P2781AF-08TT clock generator by Onsemi operates at a max output frequency of 78 MHz. It is a CMOS technology-based device with a supply voltage range of 3V to 3.6V, suitable for commercial temperature grade applications. This clock generator comes in a small outline package with dual terminals and gull wing form factor, making it ideal for surface-mount designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,245 parts In-Stock

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Digiode

USA . 610 parts In-Stock

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610

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SupplyDigital Components

Austria . 7,923 parts In-Stock

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Kulean Microsystems

USA . 4,256 parts In-Stock

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Problanco Electronics

Mexico . 3,233 parts In-Stock

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Corphita

USA . 692 parts In-Stock

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TANS Electronics

Latvia . 452 parts In-Stock

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Corohmni

South Africa . 413 parts In-Stock

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Overview

Enhance your electronic designs with the reliable P2781AF-08TT clock generator from Onsemi. Crafted with precision and expertise, this product offers superior performance and durability in a compact package. Ideal for a variety of applications, this clock generator provides a seamless solution for your timing needs. Experience the value and benefits of Onsemi's quality engineering with the P2781AF-08TT, delivering efficiency and accuracy to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight and durable, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and ensuring efficient assembly.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility in application.

Package Shape: RECTANGULAR

Rectangular shape is standard for many electronic components, making it easier to design PCB layouts and integrate the clock generator into various systems.

Maximum Output Clock Frequency: 78 MHz

With a high maximum output clock frequency, this clock generator can support high-speed operations, making it suitable for applications requiring fast data processing.

No. of Terminals: 8

Having multiple terminals allows for connections to other components or devices, enhancing the functionality and flexibility of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB, making it ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the clock generator to withstand heat in various environments, ensuring reliability in harsh conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the clock generator can function in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board layout and better signal routing, improving the overall performance of the product.

Maximum Seated Height: 1.1 mm

The low seated height allows for a compact design and easy integration into electronic devices with space constraints.

Width: 3 mm

The small width of the product makes it suitable for applications where space is limited, without compromising on performance.

Length: 4.4 mm

The short length of the product contributes to its compact design, enabling it to be used in small electronic devices or tight spaces.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges, this clock generator is suitable for standard consumer electronics and industrial applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator type ensures accurate timing signals for synchronized operations, while the additional peripheral ICs offer added functionality for diverse applications.

Technology: CMOS

Complementary metal-oxide-semiconductor technology provides efficient power consumption and high integration capabilities, making the product energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form is easy to solder and offers reliable connections to the PCB, ensuring robust performance and durability.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this clock generator is compatible with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling the clock generator to support complex electronic designs with multiple components.

Nominal Primary Clock/Crystal Frequency: 78 MHz

The high nominal primary clock or crystal frequency ensures stable and precise timing signals, making this clock generator suitable for high-performance applications.

Technical Specifications

Clock Generators P2781AF-08TT attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

78 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Peripheral IC Type:

Trade Compliance

P2781AF-08TT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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