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P2782A-08TR

Onsemi

P2782A-08TR by Onsemi

P2782A-08TR clock generator by Onsemi operates at a max output frequency of 156 MHz with a supply voltage range of 3V to 3.6V. This small outline, thin profile IC is ideal for commercial applications requiring precise clock generation in compact spaces. Featuring CMOS technology and dual-terminal position, it offers reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,506 parts In-Stock

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1,506

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Digiode

USA . 903 parts In-Stock

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903

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SupplyDigital Components

Austria . 8,015 parts In-Stock

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8,015

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Problanco Electronics

Mexico . 7,275 parts In-Stock

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7,275

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Kulean Microsystems

USA . 7,237 parts In-Stock

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TANS Electronics

Latvia . 6,595 parts In-Stock

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Corphita

USA . 1,858 parts In-Stock

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1,858

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UHIMA Technologies

Türkiye . 901 parts In-Stock

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901

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Corohmni

South Africa . 67 parts In-Stock

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Overview

Elevate your electronic devices with the high-quality clock generator P2782A-08TR by Onsemi. As a leading manufacturer in the industry, Onsemi brings you a reliable and efficient product that is perfect for a wide range of applications. With its compact design and impressive features, this clock generator offers exceptional value and benefits to customers looking to enhance their devices' performance. Upgrade your technology today with the P2782A-08TR by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight and cost-effective, making this clock generator a good choice for applications where weight and cost are important factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this clock generator is suitable for a wide range of electronic devices and systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, making this clock generator a good choice for compact designs.

Maximum Output Clock Frequency: 156 MHz

High maximum output clock frequency of 156 MHz ensures reliable performance in high-speed applications, making this clock generator suitable for a variety of devices.

No. of Terminals: 8

With 8 terminals, this clock generator offers flexibility in connectivity options, allowing for easy integration into different circuit designs.

Minimum Supply Voltage: 3 V

Low minimum supply voltage of 3 V ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70 °C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0 °C ensures reliable operation in a variety of environments, making this clock generator suitable for versatile applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity, ensuring a reliable connection between the clock generator and the PCB.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and allows for easy integration into different circuit designs.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1 mm allows for a compact and space-saving design, making this clock generator a good choice for applications with limited space.

Width: 3 mm

Small width of 3 mm allows for efficient use of space on the PCB, making this clock generator suitable for compact designs.

Length: 4.4 mm

Short length of 4.4 mm allows for efficient placement on the PCB, making this clock generator a good choice for space-constrained designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating temperatures, making this clock generator suitable for a wide range of commercial applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Peripheral IC type of Clock Generator, Other indicates that this clock generator can perform additional functions beyond generating clock signals, adding versatility to its use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this clock generator energy-efficient and reliable in operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of PCB assembly, ensuring a reliable connection between the clock generator and the PCB.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V ensures compatibility with standard power sources, making this clock generator easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65 mm allows for efficient use of space on the PCB and simplifies PCB layout, making this clock generator a good choice for compact designs.

Nominal Primary Clock/Crystal Frequency: 78 MHz

Nominal primary clock/crystal frequency of 78 MHz ensures reliable clock signal generation for a wide range of applications, making this clock generator a versatile choice.

Technical Specifications

Clock Generators P2782A-08TR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.4 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

156 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Peripheral IC Type:

Trade Compliance

P2782A-08TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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