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P2782A-08SR

Onsemi

P2782A-08SR by Onsemi

P2782A-08SR Clock Generator by Onsemi features 156 MHz output frequency, 3.6 V max supply voltage, and 8 terminals in a small outline package. Ideal for commercial applications requiring precise clock generation with a temperature range of 0 to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,640 parts In-Stock

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1,640

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Vyrian

USA . 459 parts In-Stock

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459

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Distributors (Availability)

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Kulean Microsystems

USA . 7,339 parts In-Stock

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7,339

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TANS Electronics

Latvia . 5,450 parts In-Stock

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5,450

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Problanco Electronics

Mexico . 4,740 parts In-Stock

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4,740

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SupplyDigital Components

Austria . 3,678 parts In-Stock

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3,678

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Corphita

USA . 1,455 parts In-Stock

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1,455

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Corohmni

South Africa . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 184 parts In-Stock

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Overview

Elevate your electronic designs with the P2782A-08SR clock generator by Onsemi. Crafted with precision and expertise, this clock generator offers unparalleled quality and reliability in a compact package. Perfect for a wide range of applications, this product provides exceptional value with its high performance and flexibility. Let Onsemi's innovative technology enhance your projects and take your designs to the next level. Experience the benefits of superior engineering and maximize your productivity with the P2782A-08SR clock generator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the clock generator easy to handle and less prone to damage during handling and installation.

Surface Mount: YES

Surface mount technology allows for compact and efficient design, making the clock generator suitable for applications where space is limited.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage tolerance provides flexibility in the power supply selection for the clock generator, allowing for a wider range of applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to integrate into existing circuit designs, making the clock generator versatile and compatible with various systems.

Maximum Output Clock Frequency: 156 MHz

High maximum output clock frequency allows for precise timing control in high-speed applications, making the clock generator suitable for demanding performance requirements.

No. of Terminals: 8

A sufficient number of terminals provide connectivity options for various connections, enabling easy integration of the clock generator into different circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making the clock generator ideal for applications where board space is limited.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making the clock generator versatile and adaptable to different operating conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows the clock generator to withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance in cold environments, making the clock generator suitable for outdoor or refrigerated applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring reliable electrical connections and ease of assembly during manufacturing.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit layout and component placement, making the clock generator adaptable to different PCB designs.

Maximum Seated Height: 1.75 mm

Low maximum seated height reduces the profile of the clock generator, making it suitable for applications with strict height restrictions or limited vertical space.

Width: 3.91 mm

Compact width dimension allows for efficient use of board space, making the clock generator suitable for designs where layout space is limited.

Length: 4.9 mm

Short length dimension saves board space and facilitates compact system integration, making the clock generator suitable for small form-factor applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance under standard operating conditions, making the clock generator suitable for commercial electronic products and applications.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Peripheral IC type as a clock generator ensures accurate and stable clock signals for synchronized operation of electronic devices, making it a key component in system design and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator energy-efficient and reliable in noise-prone environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stable contact with the PCB, ensuring robust connections and reliable operation of the clock generator in demanding conditions.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage specification ensures compatibility with standard power sources and voltage levels, making the clock generator easy to integrate into existing electronic systems.

Terminal Pitch: 1.27 mm

Small terminal pitch dimension allows for high-density mounting and space-saving PCB layouts, making the clock generator suitable for compact and miniaturized designs.

Nominal Primary Clock/Crystal Frequency: 78 MHz

Nominal primary clock/crystal frequency specification defines the core operating frequency of the clock generator, ensuring accurate timing and synchronization for electronic systems requiring precise clock signals.

Technical Specifications

Clock Generators P2782A-08SR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

156 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.91 mm

Peripheral IC Type:

Trade Compliance

P2782A-08SR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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