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P2781AF-08TR

Onsemi

P2781AF-08TR by Onsemi

P2781AF-08TR by Onsemi is a Clock Generator with 78 MHz output frequency, operating at 0-70 °C. It has 8 terminals, 0.65mm pitch, and is used in commercial applications requiring a 3.3V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,692 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 8,283 parts In-Stock

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Kulean Microsystems

USA . 4,350 parts In-Stock

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SupplyDigital Components

Austria . 3,947 parts In-Stock

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UHIMA Technologies

Türkiye . 953 parts In-Stock

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Corphita

USA . 521 parts In-Stock

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Corohmni

South Africa . 457 parts In-Stock

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TANS Electronics

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Overview

Enhance your electronic designs with the P2781AF-08TR clock generator by Onsemi! Crafted with precision and expertise, this small but powerful device offers a maximum output clock frequency of 78 MHz, making it perfect for a wide range of applications. From enhancing performance to ensuring accurate timing, this clock generator is a must-have for any electronic project. Experience the quality and reliability of Onsemi products and take your designs to the next level with the P2781AF-08TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the package, making it a good choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices, making it a convenient choice.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in power supply options, making it suitable for different system requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy placement in a circuit design, enhancing the overall design flexibility.

Maximum Output Clock Frequency: 78 MHz

The high maximum output clock frequency of 78 MHz ensures reliable and accurate timing signals, making it ideal for applications that require precise timing.

No. of Terminals: 8

Having 8 terminals provides sufficient connection points for various input and output signals, making it versatile for different system configurations.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm allows for a compact and slim profile, making it suitable for space-constrained applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common voltage level in electronic systems, ensuring compatibility and ease of integration.

Technical Specifications

Clock Generators P2781AF-08TR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

78 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Peripheral IC Type:

Trade Compliance

P2781AF-08TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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