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P2781BF-08TT

Onsemi

P2781BF-08TT by Onsemi

P2781BF-08TT Clock Generator by Onsemi operates at 78MHz, with a supply voltage of 3.3V. It is a CMOS technology clock generator suitable for commercial applications, featuring a small outline package with dual terminals and gull wing form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 898 parts In-Stock

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Digiode

USA . 872 parts In-Stock

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Kulean Microsystems

USA . 5,104 parts In-Stock

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TANS Electronics

Latvia . 5,042 parts In-Stock

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SupplyDigital Components

Austria . 3,970 parts In-Stock

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Corphita

USA . 2,103 parts In-Stock

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Problanco Electronics

Mexico . 427 parts In-Stock

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Corohmni

South Africa . 378 parts In-Stock

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UHIMA Technologies

Türkiye . 219 parts In-Stock

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Overview

Elevate your electronic designs with the P2781BF-08TT clock generator from Onsemi. Crafted with precision and expertise, this high-quality component offers a wide range of applications in various industries. With its compact design and reliable performance, this clock generator ensures optimal functionality and efficiency for your devices. Trust in Onsemi's reputation for excellence and unlock the full potential of your projects with the P2781BF-08TT. Choose innovation, choose reliability, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Output Clock Frequency: 78 MHz

High maximum output clock frequency of 78 MHz provides flexibility and compatibility with a wide range of applications.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and options for customization.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this clock generator can function reliably in various environments.

Nominal Supply Voltage: 3.3 V

Operates on a commonly used nominal supply voltage of 3.3V, making it compatible with many existing systems.

Technical Specifications

Clock Generators P2781BF-08TT attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

78 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

78 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Peripheral IC Type:

Trade Compliance

P2781BF-08TT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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