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NVTJD4001NT2G

Onsemi

NVTJD4001NT2G by Onsemi

NVTJD4001NT2G by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features a 30V DS Breakdown Voltage, 0.25A Drain Current, and 1.5 ohm Drain-Source Resistance. With a max operating temperature of 150 °C, it is ideal for small outline packages in automotive electronics (AEC-Q101).

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,733 parts In-Stock

1+ parts

-

100+ parts

$0.106

1k+ parts

$0.088

10k+ parts

$0.078

32,733

-

$0.106

$0.088

$0.078

Verical

USA . 30,000 parts In-Stock

1+ parts

-

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$0.098

30,000

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-

-

$0.098

Distributors (In-Stock)

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Digiode

USA . 1,483 parts In-Stock

1+ parts

$0.083

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1,483

$0.083

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Flip Electronics

USA . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 5,344 parts In-Stock

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5,344

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Distributors (Availability)

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Corphita

USA . 2,098 parts In-Stock

1+ parts

$0.078

100+ parts

-

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2,098

$0.078

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Corohmni

South Africa . 182 parts In-Stock

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$0.087

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182

$0.087

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$1.126

100+ parts

$1.025

1k+ parts

$0.923

10k+ parts

-

60

$1.126

$1.025

$0.923

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AZTECH Wire

Italy . 1,022 parts In-Stock

1+ parts

$21.740

100+ parts

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1,022

$21.740

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QUARKTWIN TECHNOLOGY LTD

USA . 29,709 parts In-Stock

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29,709

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 8,198 parts In-Stock

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Problanco Electronics

Mexico . 2,337 parts In-Stock

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2,337

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Kulean Microsystems

USA . 790 parts In-Stock

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TANS Electronics

Latvia . 423 parts In-Stock

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UHIMA Technologies

Türkiye . 124 parts In-Stock

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124

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Overview

Looking for a reliable and high-quality solution for your switching applications? Look no further than the NVTJD4001NT2G by Onsemi! With its N-CHANNEL configuration, separate 2 elements with built-in diode, and small outline package style, this field effect transistor offers exceptional performance and reliability. Whether you're in the automotive industry or working on consumer electronics, this product provides value and benefits that will exceed your expectations. Trust Onsemi's reputation for excellence and choose the NVTJD4001NT2G for all your small signal FET needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and resistant to impact, making it ideal for portable electronics or applications in harsh environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, which results in better transistor performance and efficiency compared to P-channel transistors.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more complex circuit designs and functionality, making the transistor versatile and suitable for a variety of applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power dissipation, making it ideal for energy-efficient designs.

Surface Mount: YES

Surface mount package allows for easy and efficient assembly onto PCBs, saving space and enabling automated production processes.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle relatively high voltage levels, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.272 W

The low power dissipation of 0.272W ensures that the transistor operates efficiently and can withstand moderate power levels without overheating.

Maximum Drain Current (ID): 0.25 A

Capable of handling a maximum drain current of 0.25A, this transistor is suitable for low to moderate current applications, such as microcontroller outputs or LED drivers.

Maximum Drain-Source On Resistance: 1.5 ohm

The low drain-source on resistance of 1.5 ohms results in minimal voltage drop across the transistor when conducting, leading to higher efficiency and reduced power loss.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments, ensuring reliable operation in challenging conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) NVTJD4001NT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

1.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVTJD4001NT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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