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NVTFS4C08NWFTWG

Onsemi

NVTFS4C08NWFTWG by Onsemi

NVTFS4C08NWFTWG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 253A IDM, and 0.0059 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance. Operating in enhancement mode, it offers high power dissipation of 31W and can withstand temperatures from -55 to 175 °C.

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Flip Electronics

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Vyrian

USA . 7,143 parts In-Stock

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Digiode

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Microchip USA

USA . 6,643 parts In-Stock

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AZTECH Wire

Italy . 566 parts In-Stock

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Kepictronics

USA . 218,500 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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Problanco Electronics

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TANS Electronics

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Perfect Parts

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UHIMA Technologies

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Overview

Experience the power and reliability of the NVTFS4C08NWFTWG by Onsemi, a top-quality Power Field Effect Transistor that offers superior performance in various applications. Crafted by the reputable manufacturer Onsemi, this N-CHANNEL FET is designed with a built-in diode for added convenience. With a minimum DS Breakdown Voltage of 30V and a Maximum Pulsed Drain Current of 253A, this transistor delivers exceptional power and efficiency. Whether you're looking to enhance your electronic devices or optimize your power management systems, the NVTFS4C08NWFTWG promises unmatched value, benefits, and advantages to all customers seeking top-tier performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this FET lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance and efficiency compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide protection against reverse voltage spikes.

Surface Mount: YES

Being a surface mount component, this FET is suitable for compact and space-constrained PCB layouts.

Minimum DS Breakdown Voltage: 30 V

The high minimum breakdown voltage ensures reliability and protection against voltage spikes.

Package Shape: SQUARE

The square package shape allows for easy and secure mounting on the PCB.

Terminal Form: FLAT

The flat terminal form provides stable electrical connections during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the FET's switching characteristics.

Maximum Pulsed Drain Current (IDM): 253 A

The high maximum pulsed drain current capability makes this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 20 mJ

The FET's high avalanche energy rating indicates its ability to withstand high energy spikes without damage.

Maximum Drain Current (Abs) (ID): 55 A

The high maximum drain current rating allows for reliable operation in high-current applications.

No. of Terminals: 5

The 5 terminals provide flexibility in circuit configurations and connections.

Maximum Power Dissipation (Abs): 31 W

The high maximum power dissipation rating ensures efficient heat dissipation during operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in FET operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature makes this FET suitable for a wide range of operating conditions.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability in electronic circuits.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature rating ensures reliable operation even in harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good electrical conductivity and corrosion resistance for the terminals.

Maximum Drain Current (ID): 55 A

The high maximum drain current rating allows for reliable operation in high-current applications.

Maximum Drain-Source On Resistance: 0.0059 ohm

The low drain-source on resistance results in lower power losses and higher efficiency.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit connections and layouts.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and enhances thermal management.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering in high-temperature assembly processes.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C08NWFTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

55 A

Maximum Drain-Source On Resistance:

.0059 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

253 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C08NWFTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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