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NVTFS4C08NWFTAG

Onsemi

NVTFS4C08NWFTAG by Onsemi

NVTFS4C08NWFTAG by Onsemi is a Power FET with 30V DS Breakdown Voltage, 253A IDM, and 0.0059 ohm RDS(on). It is an N-CHANNEL transistor in a PLASTIC/EPOXY package suitable for automotive applications due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

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3

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1k+

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Flip Electronics

USA . 200,000 parts In-Stock

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Vyrian

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Microchip USA

USA . 486 parts In-Stock

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AZTECH Wire

Italy . 1,102 parts In-Stock

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Kulean Microsystems

USA . 6,534 parts In-Stock

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Perfect Parts

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 942 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NVTFS4C08NWFTAG by Onsemi. As a leading manufacturer in the Power Field Effect Transistors (FET) category, Onsemi delivers top-notch quality and cutting-edge technology. This N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for a wide range of applications. From automotive to industrial use, this transistor offers maximum power dissipation, high pulsing current capabilities, and enhanced energy ratings. Trust Onsemi to provide you with superior products that deliver exceptional value and benefits, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package provides good insulation and protection for the transistor, enhancing its durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher mobility, making them more efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current flow protection in the circuit, increasing the overall reliability of the system.

Maximum Drain-Source On Resistance: 0.0059 ohm

The low on-resistance of the transistor results in minimal power loss and higher efficiency in power applications.

Maximum Drain Current (ID): 55 A

With a high maximum drain current, this FET can handle large power loads, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 31 W

The high power dissipation capability allows the FET to handle large amounts of power without overheating, ensuring stable performance.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4C08NWFTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

55 A

Maximum Drain-Source On Resistance:

.0059 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

253 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4C08NWFTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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