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NVTFS4823NTAG

Onsemi

NVTFS4823NTAG by Onsemi

NVTFS4823NTAG by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 198A IDM, and 0.0175 ohm RDS(on). Ideal for power applications requiring high current handling in a compact form factor. Operating in enhancement mode, it offers efficient performance up to 175°C with a max power dissipation of 21W.

Median Price

$0.385

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 15,000 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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$0.385

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150

$0.385

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Sternenhof Electronics

Switzerland . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 6,900 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Bristol Electronics

USA . 1,300 parts In-Stock

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1,300

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Dan-Mar Components

USA . 1,300 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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217

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Distributors (Availability)

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Corohmni

South Africa . 226 parts In-Stock

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$0.370

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Aranea Global

USA . 500 parts In-Stock

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$0.377

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$0.362

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500

$0.377

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$0.362

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AZTECH Wire

Italy . 252 parts In-Stock

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$12.630

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Ampacity Inc.

Singapore . 849 parts In-Stock

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$48.050

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Perfect Parts

USA . 34,003 parts In-Stock

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TANS Electronics

Latvia . 5,085 parts In-Stock

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Problanco Electronics

Mexico . 3,679 parts In-Stock

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SupplyDigital Components

Austria . 1,320 parts In-Stock

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Corphita

USA . 663 parts In-Stock

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Kulean Microsystems

USA . 317 parts In-Stock

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NVTFS4823NTAG by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted a top-of-the-line Power Field Effect Transistor (FET) that delivers unparalleled performance and reliability. With its N-CHANNEL design, SINGLE WITH BUILT-IN DIODE configuration, and ENHANCEMENT MODE operation, this transistor is perfect for a wide range of applications. From automotive to industrial electronics, the NVTFS4823NTAG offers customers exceptional value, efficiency, and durability. Experience the difference with Onsemi's innovative product that sets the standard for quality and excellence in the field.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher electron mobility and lower ON-resistance compared to P-Channel FETs, making them more efficient for various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from reverse voltage spikes, enhancing the reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels, making it suitable for power applications.

Maximum Pulsed Drain Current (IDM): 198 A

The high pulsed drain current rating of 198A allows the FET to handle sudden spikes in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 28.8 mJ

The high avalanche energy rating indicates that the FET can safely operate in applications where high-energy transients may occur.

Maximum Power Dissipation (Abs): 21 W

With a maximum power dissipation of 21W, this FET can handle high power levels without overheating, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high switching speeds and low ON-resistance, making the FET suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures the FET can operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS4823NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

28.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.0175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

198 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFS4823NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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