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NVMFS5C460NLT3G

Onsemi

NVMFS5C460NLT3G by Onsemi

NVMFS5C460NLT3G by Onsemi is a single N-channel power FET with a min DS breakdown voltage of 40V and max pulsed drain current of 396A. It operates in enhancement mode, has a max power dissipation of 50W, and is suitable for applications requiring high drain currents such as automotive systems.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 572 parts In-Stock

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Problanco Electronics

Mexico . 8,081 parts In-Stock

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Kulean Microsystems

USA . 6,290 parts In-Stock

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TANS Electronics

Latvia . 3,033 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 480 parts In-Stock

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Corohmni

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UHIMA Technologies

Türkiye . 83 parts In-Stock

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Overview

Upgrade your power systems with the NVMFS5C460NLT3G by Onsemi, a high-quality N-channel Power FET that guarantees top-notch performance and reliability. Manufactured by Onsemi, a leading name in semiconductor technology, this product offers exceptional value with its enhanced power dissipation capabilities and superior operating temperature range. Ideal for various applications, this FET is designed for efficiency, durability, and ease of use. Trust Onsemi's expertise and choose the NVMFS5C460NLT3G for all your power system needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term usage.

Polarity or Channel Type: N-CHANNEL

N-channel type offers better performance and efficiency in power applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation in circuit boards.

Minimum DS Breakdown Voltage: 40 V

Breakdown voltage of 40V ensures protection against voltage spikes and overloads.

Maximum Pulsed Drain Current (IDM): 396 A

High pulsed drain current rating of 396A allows for handling heavy current loads.

Maximum Drain-Source On Resistance: 0.0072 ohm

Low drain-source on resistance of 0.0072 ohm ensures efficient power dissipation and minimal losses.

Maximum Operating Temperature: 175 °C

High operating temperature of 175 °C enables reliable performance in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C460NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

107 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

78 A

Maximum Drain Current (ID):

78 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

396 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C460NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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