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NVMFS5C442NWFT3G

Onsemi

NVMFS5C442NWFT3G by Onsemi

NVMFS5C442NWFT3G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0023 ohm RDS(on). Ideal for power management applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Flip Electronics

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Vyrian

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Digiode

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Microchip USA

USA . 392 parts In-Stock

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AZTECH Wire

Italy . 738 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 6,980 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Corphita

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UHIMA Technologies

Türkiye . 662 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS5C442NWFT3G by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it ideal for a wide range of applications. From enhancing efficiency in power supplies to boosting performance in motor control systems, this N-CHANNEL FET with a built-in diode is a game-changer. Experience the benefits of its advanced technology, including enhanced energy efficiency and maximum power dissipation. Trust Onsemi for cutting-edge solutions that deliver value and excellence to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON resistance and higher current capabilities, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of reliability to the transistor.

Surface Mount: YES

Surface mount packaging saves space and allows for easier integration onto PCBs for space-constrained designs.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures the transistor can handle higher voltage applications without damage.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed current rating allows the transistor to handle brief spikes in current without overheating or failure.

Avalanche Energy Rating (EAS): 220 mJ

The high avalanche energy rating indicates the transistor can withstand energy spikes and transient events without damage.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation capability allows the transistor to handle high power loads without overheating.

Maximum Drain-Source On Resistance: 0.0023 ohm

The low ON resistance of the transistor results in efficient power conduction and minimal power loss.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C442NWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.0023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

40 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C442NWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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